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Your search for "ic substrate" gave back 8614 results.
The global market for AlN Electronic Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Glass Substrate in Semiconductor was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for 3D Through Glass Via Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Wafer Hybrid Bonding Machine market size is predicted to grow from US$ 197 million in 2025 to US$ 773 million in 2031; it is expected to...
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LPI
February 2025
Price: USD 3,660.00
The global COF Flexible Encapsulation Substrate market size was valued at US$ million in 2023. With growing demand in downstream market, the COF...
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LPI
December 2024
Price: USD 3,660.00
The global market for Substrates for Semiconductor Test Probe Card was valued at US$ 26.1 million in the year 2023 and is projected to reach a...
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MRRPB5
December 2024
Price: USD 2,900.00
The global Alumina Multilayered Ceramic Substrates and Packages market size was valued at US$ 390 million in 2024 and is forecast to a readjusted...
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GIR
July 2025
Price: USD 3,480.00
The global market for Electric Materials Ceramic Substrate was valued at US$ million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for BGA Package Substrate was valued at US$ 7020 million in the year 2024 and is projected to reach a revised size of US$ 10630...
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MRRPB5
February 2025
Price: USD 2,900.00
Semiconductor package substrate is a core part in semiconductor packaging process, which is a high density board of fine circuit that connects...
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MRRPB5
December 2024
Price: USD 4,900.00
The global market for CSP Package Substrate was valued at US$ 6142 million in the year 2024 and is projected to reach a revised size of US$ 9064...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Thin Film Ceramic Substrates for Electronic Packaging was valued at US$ million in the year 2024 and is projected to reach a...
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MRRPB5
February 2025
Price: USD 2,900.00
The global COF Flexible Encapsulation Substrate market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by...
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GIR
December 2024
Price: USD 3,480.00
The global Glass Substrate for Semiconductor Packaging market size was valued at USD 1255.3 million in 2023 and is forecast to a readjusted size of...
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GIR
December 2024
Price: USD 3,480.00
The global Embedded Die Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Embedded Die Packaging...
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LPI
December 2024
Price: USD 3,660.00
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