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Your search for "ic substrate" gave back 33654 results.
The global Semiconductor Photolithography Equipment market size is predicted to grow from US$ 27370 million in 2025 to US$ 40350 million in 2031; it...
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LPI
March 2025
Price: USD 3,660.00
The global market for JIW Wafers was valued at US$ 326 million in the year 2023 and is projected to reach a revised size of US$ 496 million by 2030,...
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MRRPB5
January 2025
Price: USD 2,900.00
The global Electronic Printed Circuit Board (PCB) market size was valued at US$ million in 2023. With growing demand in downstream market, the...
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LPI
August 2024
Price: USD 3,660.00
The global PCB Equipment market was valued at US$ 6611 million in 2023 and is anticipated to reach US$ 8529.7 million by 2030, witnessing a CAGR of 3...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Resin for Photoresist market size is predicted to grow from US$ 645 million in 2025 to US$ 1038 million in 2031; it is expected to grow at...
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LPI
February 2025
Price: USD 3,660.00
The global market for Polishing N-type Silicon Wafer was valued at US$ 4158 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
Silicon ingots for semiconductor applications are high-purity, crystal silicon structures that serve as the fundamental material in the manufacturing...
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MRRPB5
July 2024
Price: USD 2,900.00
In semiconductor fabrication, a resist is a thin layer used to transfer a circuit pattern to the semiconductor substrate which it is deposited upon...
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MRRPB5
October 2023
Price: USD 2,900.00
A photoresist is a light-sensitive substance that is used to generate a structured covering on a substrate in a variety of procedures such as...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Semiconductor Photoresists market size is projected to grow from US$ million in 2023 to US$ million in 2030; it is expected to grow at a...
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LPI
May 2024
Price: USD 3,660.00
Thin film deposition is the process of creating and depositing thin film coatings onto a substrate material. These coatings can be made of many...
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MRRPB5
January 2024
Price: USD 2,900.00
Double-head die bonder is a kind of equipment used to fix and package electronic components. It is commonly used in the semiconductor industry,...
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MRRPB5
August 2024
Price: USD 2,900.00
This report studies the Printed Circuit Board market status and outlook of global and major regions, from angles of manufacturers, regions, product...
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MRRPB5
January 2024
Price: USD 2,900.00
This report studies the Printed Circuit Board market status and outlook of global and major regions, from angles of manufacturers, regions, product...
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GIR
September 2024
Price: USD 3,480.00
Chip design, also known as integrated circuit design (IC design), also known as VLSI design, refers to the design process aiming at integrated...
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MRRPB5
July 2024
Price: USD 2,900.00
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