0 items USD 0.00Search
Your search for "3D packaging" gave back 107384 results.
In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die...
颁补迟补濒辞驳:听
MRRPB5
October 2024
Price: USD 3,950.00
The global 3D TSV Package market size was valued at US$ 844.2 million in 2023. With growing demand in downstream market, the 3D TSV Package is...
颁补迟补濒辞驳:听
LPI
October 2024
Price: USD 3,660.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
颁补迟补濒辞驳:听
MRRPB5
July 2024
Price: USD 4,900.00
The global market for 2.5D and 3D Semiconductor Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
颁补迟补濒辞驳:听
MRRPB5
January 2025
Price: USD 2,900.00
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
颁补迟补濒辞驳:听
MRRPB5
September 2024
Price: USD 3,950.00
IC packaging refers to the material that contains a semiconductor device. The package is a case that surrounds the circuit material to protect it...
颁补迟补濒辞驳:听
MRRPB5
November 2024
Price: USD 3,950.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 5,900.00
System in package (SiP) refers to mixing different types of components in the same package through different technologies, thus forming a system...
颁补迟补濒辞驳:听
LPI
October 2024
Price: USD 3,660.00
Copper Core Balls are a type of spherical component used primarily in 3D packaging and advanced semiconductor assembly. They consist of a copper core...
颁补迟补濒辞驳:听
MRRPB5
November 2024
Price: USD 2,900.00
The global market for 3D IC and 2.5D IC Packaging was estimated to be worth US$ 100020 million in 2023 and is forecast to a readjusted size of US$...
颁补迟补濒辞驳:听
MRRPB5
September 2024
Price: USD 3,950.00
The global 3D ICs Packaging Solution market size was valued at US$ million in 2023. With growing demand in downstream market, the 3D ICs Packaging...
颁补迟补濒辞驳:听
LPI
June 2024
Price: USD 3,660.00
A System in a Package (SiP) or system-in-package is a number of integrated circuits enclosed in one or more chip carrier packages that may be stacked...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The global System In a Package (SIP) and 3D Packaging market size was valued at US$ 8321 million in 2023. With growing demand in downstream market,...
颁补迟补濒辞驳:听
LPI
January 2024
Price: USD 3,660.00
The global 3D Semiconductor Packaging market size was valued at US$ 1514.1 million in 2023. With growing demand in downstream market, the 3D...
颁补迟补濒辞驳:听
LPI
January 2024
Price: USD 3,660.00
The global 2.5D Heterogeneous and 3D Wafer-Level Stack Packaging Technology market size is projected to grow from US$ million in 2024 to US$ million...
颁补迟补濒辞驳:听
LPI
July 2024
Price: USD 3,660.00
听
