0 items USD 0.00Search
- Did you mean
- chip scale packaging
Your search for "Chip Scale Package" gave back 140946 results.
In order to provide greater security and efficiency, many data centers are overseeing the widespread implementation of artificial intelligence (AI)...
颁补迟补濒辞驳:听
MRRPB5
May 2023
Price: USD 2,900.00
Worldwide markets are poised to achieve significant growth as the artificial intelligence software, IOT Internet of things, drones, self driving cars...
颁补迟补濒辞驳:听
WinterGreen Research
October 2017
Price: USD 4,200.00
Food Packaging Barrier Film are an integral part of food packagingsolutions, especially in thin plastic-based products. The Food Packaging Barrier...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
Single-Chip Step-Down Voltage Regulator is a chip that integrates functions such as a buck converter and a voltage regulator, which can reduce the...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 4,900.00
The ceramic capillary is an axisymmetric ceramic tool with a vertical center hole, which is used for wire bonding packaging of LEDs, diodes, triodes...
颁补迟补濒辞驳:听
MRRPB5
March 2024
Price: USD 2,900.00
The global Semiconductor Assembly Test Service market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a...
颁补迟补濒辞驳:听
MRRPB5
March 2023
Price: USD 2,900.00
The global Freeze Drying Machine market was valued at US$ 941.5 million in 2023 and is anticipated to reach US$ 1362.4 million by 2030, witnessing a...
颁补迟补濒辞驳:听
MRRPB5
July 2024
Price: USD 2,900.00
The universal programming socket is a device used for programming (programming) various types of integrated circuit chips. These sockets are usually...
颁补迟补濒辞驳:听
MRRPB5
February 2024
Price: USD 2,900.00
The global Lead Solder Ball market size was valued at US$ 15 million in 2023. With growing demand in downstream market, the Lead Solder Ball is...
颁补迟补濒辞驳:听
LPI
February 2024
Price: USD 3,660.00
The global Solder Spheres market size was valued at US$ 237 million in 2023. With growing demand in downstream market, the Solder Spheres is forecast...
颁补迟补濒辞驳:听
LPI
February 2024
Price: USD 3,660.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The global Solder Ball market size was valued at US$ 246.7 million in 2023. With growing demand in downstream market, the Solder Ball is forecast to...
颁补迟补濒辞驳:听
LPI
January 2024
Price: USD 3,660.00
Food Packaging Barrier Film are an integral part of food packagingsolutions, especially in thin plastic-based products. The Food Packaging Barrier...
颁补迟补濒辞驳:听
GIR
August 2024
Price: USD 3,480.00
The global Antenna-in-Package Technology market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of %...
颁补迟补濒辞驳:听
MRRPB5
November 2023
Price: USD 2,900.00
听
