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Your search for "Chip Scale Package" gave back 139434 results.
The global Thin Film Lithium Niobate (TFLN) Modulator market size was valued at US$ 181 million in 2023. With growing demand in downstream market,...
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LPI
August 2024
Price: USD 3,660.00
The global IC Advanced Packaging Equipment market size was valued at US$ 8126 million in 2024 and is forecast to a readjusted size of USD 14560...
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GIR
July 2025
Price: USD 3,480.00
The global Micro Ambient Light Sensor Chip market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
July 2024
Price: USD 2,900.00
The Chip Decap Machine is used to locally corrode the fully packaged IC, so that the IC can be exposed while maintaining the integrity of the chip...
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MRRPB5
November 2024
Price: USD 3,950.00
Surface Mount FPGA is an integrated circuit chip, which is usually used to realize the design and implementation of digital circuits. FPGAs can be...
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MRRPB5
May 2023
Price: USD 2,900.00
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
March 2023
Price: USD 2,900.00
An integrated circuit packaging and testing system is a device used to test packaged integrated circuit (IC) chips. This system is mainly used to...
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GIR
September 2024
Price: USD 3,480.00
A process wherein a semiconductor chip is packaged in a form suitable for the electronic device. Semiconductor packaging is a process of protecting...
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LPI
November 2024
Price: USD 3,660.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Integrated Circuit Packaging Solder Ball market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD...
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GIR
December 2024
Price: USD 3,480.00
The global market for Chip Laser Decapping Machine was valued at US$ 96 million in the year 2024 and is projected to reach a revised size of US$ 138...
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MRRPB5
April 2025
Price: USD 2,900.00
The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip...
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MRRPB5
April 2024
Price: USD 3,950.00
Fully-automated industrial versions are for large-scale mass production. Die bonders are specialized semi- or fully-automatic high-precision machine...
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MRRPB5
February 2023
Price: USD 2,900.00
The global market for System In a Package (SIP) and 3D Packaging was valued at US$ 11460 million in the year 2024 and is projected to reach a revised...
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MRRPB5
April 2025
Price: USD 2,900.00
The Fan-Out WLP technique involves cutting and separating the chip and then embedding the chip inside the panel. The procedure is to attach the chip...
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MRRPB5
January 2023
Price: USD 2,900.00
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