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Your search for "Chip Scale Package" gave back 140306 results.
Semi-Package Testing Probe is a high-end precision electronic component, which is mainly used in the semiconductor testing process to test the...
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MRRPB5
February 2023
Price: USD 2,900.00
Semiconductor test probe is a high-end precision electronic component, which is mainly used in the semiconductor testing process to test the...
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MRRPB5
February 2023
Price: USD 2,900.00
The global Active Quartz Crystal Oscillator Chip market size was valued at US$ million in 2023. With growing demand in downstream market, the Active...
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LPI
October 2024
Price: USD 3,660.00
The global Polypropylene Snack Food Packaging market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by...
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GIR
May 2025
Price: USD 3,480.00
The global Metal Shell for Microelectronic Packages market size was valued at US$ 2048 million in 2024 and is forecast to a readjusted size of USD...
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GIR
July 2025
Price: USD 3,480.00
Metal is still the main material of electronic packaging because of its advantages such as good mechanical strength, good thermal conductivity,...
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MRRPB5
January 2023
Price: USD 2,900.00
The process of processing the tested wafer to obtain an independent chip, so that the circuit chip is protected from the influence of the surrounding...
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MRRPB5
April 2024
Price: USD 2,900.00
Gold bump are most commonly used in semiconductor packaging relating to TCP, COF, COG technology and photoelectron component off-chip interconnect...
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MRRPB5
January 2023
Price: USD 2,900.00
Gold bump are most commonly used in semiconductor packaging relating to TCP, COF, COG technology and photoelectron component off-chip interconnect...
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MRRPB5
January 2023
Price: USD 2,900.00
The global market for Gold Bump was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing...
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MRRPB5
January 2025
Price: USD 2,900.00
The global Film Grade Polyester Chip market is projected to grow from US$ 955.7 million in 2024 to US$ 1348 million by 2030, at a Compound Annual...
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MRRPB5
August 2024
Price: USD 4,900.00
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for Explosion Proof Filling Machine was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
November 2024
Price: USD 3,950.00
Viral Vector Packaging Services refer to specialized services that provide the packaging of genetic material into viral vectors for various research...
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MRRPB5
December 2024
Price: USD 3,950.00
The global market for Polypropylene Snack Food Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
March 2025
Price: USD 2,900.00
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