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Your search for "Chip Scale Package" gave back 138123 results.
Spherical silica for melamine-urea-formaldehyde (MUF) refers to silica-based particles used as an extender and reinforcement in MUF adhesives and...
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MRRPB5
October 2023
Price: USD 2,900.00
Traditional packaging usually refers to a process in which wafers are first cut into individual chips and then packaged. Advanced packaging such as...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Spherical Silica for MUF market size was valued at US$ 24 million in 2023. With growing demand in downstream market, the Spherical Silica...
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LPI
October 2024
Price: USD 3,660.00
The global Semiconductor Wafer-level and Advanced Packaging Inspection Systems market size was valued at US$ 410.6 million in 2023. With growing...
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LPI
December 2024
Price: USD 3,660.00
The global market for TGV Glass Core Substrate was valued at US$ 206 million in the year 2024 and is projected to reach a revised size of US$ 607...
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MRRPB5
June 2025
Price: USD 2,900.00
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
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MRRPB5
March 2023
Price: USD 4,900.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
March 2024
Price: USD 2,900.00
The global CSP Packaging Solder Ball market size was valued at USD 85 million in 2023 and is forecast to a readjusted size of USD 131.4 million by...
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GIR
April 2024
Price: USD 3,480.00
CSP, or Chip Scale Package, is a type of integrated circuit (IC) packaging that is designed to be roughly the same size as the semiconductor die it...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Electronic Underfill Material market size was valued at USD 323.1 million in 2023 and is forecast to a readjusted size of USD 436.8...
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GIR
November 2024
Price: USD 3,480.00
This report provides the research findings of our study of the worldwide consumption of packaged Light Emitting Diodes (LEDs), in Scientific and...
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ElectroniCast
February 2015
Price: USD 5,100.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
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MRRPB5
September 2024
Price: USD 3,950.00
Flip chip welding machine is a kind of equipment specially used to realize flip chip welding process. Flip chip welding is to weld the chip face down...
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MRRPB5
May 2024
Price: USD 2,900.00
The underfill adhesive is a kind of chemical glue (the main component is epoxy resin) to fill the bottom of the BGA packaging mode chip, using the...
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MRRPB5
January 2024
Price: USD 2,900.00
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and...
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MRRPB5
January 2024
Price: USD 2,900.00
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