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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 292256 results.
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
October 2024
Price: USD 3,950.00
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
July 2024
Price: USD 2,900.00
Low-alpha beam high purity silica refers to high-purity silica wafers used in semiconductor manufacturing for low alpha particle emission. The global...
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MRRPB5
October 2023
Price: USD 2,900.00
Die bonding paste, also known as die attach paste or die attach adhesive, is a specialized material used in semiconductor packaging to bond...
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MRRPB5
April 2024
Price: USD 2,900.00
The global market for Low-alpha Beam High Purity Silica was valued at US$ 107 million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
March 2025
Price: USD 2,900.00
Low-alpha beam high purity silica refers to high-purity silica wafers used in semiconductor manufacturing for low alpha particle emission. The global...
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MRRPB5
April 2024
Price: USD 2,900.00
The global market for IC Package Substrate Material was valued at US$ 6950 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Electrodeposited Copper Foil for PCB market was valued at US$ 5667 million in 2023 and is anticipated to reach US$ 9642 million by 2030,...
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MRRPB5
November 2024
Price: USD 2,900.00
The packaging substrate is the largest part of the packaging material cost, and it mainly plays the role of carrying and protecting the chip and...
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MRRPB5
March 2023
Price: USD 2,900.00
The global Extreme Ultraviolet (EUV) Photomask Substrates market size was valued at USD million in 2023 and is forecast to a readjusted size of USD...
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GIR
April 2024
Price: USD 3,480.00
The global Aluminium Nitride Substrate market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with...
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GIR
May 2024
Price: USD 3,480.00
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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MRRPB5
April 2024
Price: USD 2,900.00
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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GIR
April 2024
Price: USD 3,480.00
The global market for Chip Encapsulation Material was valued at US$ 26960 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
March 2025
Price: USD 2,900.00
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC)...
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MRRPB5
August 2023
Price: USD 2,900.00
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