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Your search for "Flip Chip Ball Grid Array" gave back 58329 results.
The global Ball Grid Array (BGA) Packages market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
March 2023
Price: USD 2,900.00
A ball grid array (BGA) socket is designed for mounting package boards that use a grid of solder balls, known as BGAs. Unlike the pin grid array (PGA...
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GIR
April 2024
Price: USD 3,480.00
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has...
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MRRPB5
February 2024
Price: USD 2,900.00
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has...
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MRRPB5
April 2023
Price: USD 2,900.00
Highlights The global Circuit Board Chips Protecting Encapsulant market is projected to reach US$ million by 2028 from an estimated US$ million in...
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MRRPB5
January 2023
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
August 2024
Price: USD 4,900.00
After the automatic alignment by vision inspection, the solder balls as well as Coper core balls are gang-mounted on the BGA (ball grid array) strip-...
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MRRPB5
May 2024
Price: USD 2,900.00
Electrochemical Deposition is a rapid and cost-effective method of laying down the bulk of the copper wiring in semiconductor device manufacturing...
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LPI
July 2024
Price: USD 3,660.00
The global Circuit Board Chips Protecting Encapsulant market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
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MRRPB5
April 2024
Price: USD 2,900.00
The global market for Underfills for Semiconductor was valued at US$ 276 million in the year 2024 and is projected to reach a revised size of US$ 460...
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MRRPB5
May 2025
Price: USD 2,900.00
The global Bump Flattening Machine market size is projected to grow from US$ 4 million in 2023 to US$ 4 million in 2030; it is expected to grow at a...
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LPI
April 2024
Price: USD 3,660.00
Electrochemical Deposition is a rapid and cost-effective method of laying down the bulk of the copper wiring in semiconductor device manufacturing...
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MRRPB5
June 2024
Price: USD 2,900.00
The FC-BGA (Flip Chip Ball Grid Array) semiconductor substrate is a critical component in advanced electronic packaging, particularly in high-...
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LPI
November 2024
Price: USD 3,660.00
The process of assembling an integrated circuit into the final product of a chip The global market for OSA Capsulation was estimated to be worth US$...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Circuit Board Chips Protecting Encapsulant market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound...
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MRRPB5
November 2024
Price: USD 4,900.00
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