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Your search for "Flip Chip Ball Grid Array" gave back 6457 results.
The global Liquid Molding Compounds (LMC) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Liquid Molding Compounds (LMC) market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
February 2023
Price: USD 2,900.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
November 2024
Price: USD 3,950.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
November 2024
Price: USD 3,950.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
June 2024
Price: USD 2,900.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
June 2024
Price: USD 2,900.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
March 2023
Price: USD 2,900.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
March 2023
Price: USD 2,900.00
Ball-attach flux, often referred to as solder ball-attach flux or BGA (Ball Grid Array) attach flux, is a specialized flux used in electronic...
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MRRPB5
October 2024
Price: USD 3,950.00
An Arrayed Waveguide Grating (AWG) chip is a device based on photonic integrated technology that uses waveguide structures to separate or multiplex...
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LPI
October 2024
Price: USD 3,660.00
Ball-attach flux, often referred to as solder ball-attach flux or BGA (Ball Grid Array) attach flux, is a specialized flux used in electronic...
°ä²¹³Ù²¹±ô´Ç²µ:Ìý
MRRPB5
August 2024
Price: USD 2,900.00
An Arrayed Waveguide Grating (AWG) chip is a device based on photonic integrated technology that uses waveguide structures to separate or multiplex...
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MRRPB5
September 2024
Price: USD 2,900.00
FC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Underfills for Semiconductor market size was valued at US$ 527.6 million in 2023. With growing demand in downstream market, the Underfills...
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LPI
January 2024
Price: USD 3,660.00
The global market for FC Underfills was valued at US$ 181 million in the year 2024 and is projected to reach a revised size of US$ 327 million by...
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MRRPB5
March 2025
Price: USD 2,900.00

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