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Your search for "Flip Chip Ball Grid Array" gave back 6429 results.
The global FC Underfills market size was valued at US$ 149.7 million in 2023. With growing demand in downstream market, the FC Underfills is forecast...
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LPI
October 2024
Price: USD 3,660.00
FC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Capillary Underfill Material market size was valued at USD 501.1 million in 2023 and is forecast to a readjusted size of USD 838.8 million...
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GIR
May 2024
Price: USD 3,480.00
The global Underfills for Semiconductor market size is predicted to grow from US$ 298 million in 2025 to US$ 457 million in 2031; it is expected to...
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LPI
August 2025
Price: USD 3,660.00
An underfill is a composite material made up of an epoxy polymer with significant amounts of filler. Underfill is one of the Flip-Chip processes for...
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MRRPB5
December 2024
Price: USD 3,950.00
The global Underfills for Semiconductor market size was valued at US$ 624 million in 2024 and is forecast to a readjusted size of USD 1103 million by...
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GIR
January 2025
Price: USD 3,480.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
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MRRPB5
February 2024
Price: USD 2,900.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
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GIR
September 2024
Price: USD 3,480.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
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MRRPB5
February 2023
Price: USD 2,900.00
HJ Research delivers in-depth insights on the global Pb-free Solder market in its upcoming report titled, Global Pb-free Solder Market Report 2015-...
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HJResearch
July 2022
Price: USD 3,200.00
The global Micronporous Silicon Nitride TEM Window Grids market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
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MRRPB5
August 2024
Price: USD 2,900.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
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MRRPB5
August 2024
Price: USD 4,900.00
HJ Research delivers in-depth insights on the global Lead-free Solder Alloy market in its upcoming report titled, Global Lead-free Solder Alloy...
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HJResearch
July 2022
Price: USD 3,200.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
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MRRPB5
June 2024
Price: USD 5,900.00
The global Advanced Epoxy Molding Compounds market size was valued at US$ 321.8 million in 2023. With growing demand in downstream market, the...
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LPI
October 2024
Price: USD 3,660.00
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