0 items USD 0.00Search
- Did you mean
- flir chip wall grid array
Your search for "Flip Chip Ball Grid Array" gave back 5291 results.
The global Flux for Semiconductor Packaging market size was valued at USD 101.9 million in 2023 and is forecast to a readjusted size of USD 146.8...
颁补迟补濒辞驳:听
GIR
October 2024
Price: USD 3,480.00
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "...
颁补迟补濒辞驳:听
MRRPB5
October 2023
Price: USD 2,900.00
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "...
颁补迟补濒辞驳:听
MRRPB5
September 2024
Price: USD 3,950.00
The global Solder Bumps market size was valued at USD 235 million in 2023 and is forecast to a readjusted size of USD 347.3 million by 2030 with a...
颁补迟补濒辞驳:听
GIR
June 2024
Price: USD 3,480.00
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The global High Temperature Solder Ball market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031...
颁补迟补濒辞驳:听
GIR
May 2025
Price: USD 3,480.00
The global Tin Alloy Solder Ball market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a...
颁补迟补濒辞驳:听
GIR
May 2025
Price: USD 3,480.00
The global market for Solder Ball Flux was valued at US$ 558 million in the year 2024 and is projected to reach a revised size of US$ 873 million by...
颁补迟补濒辞驳:听
MRRPB5
March 2025
Price: USD 2,900.00
The global High Temperature Solder Ball market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
The global Tin Alloy Solder Ball market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
The global Solder Ball Flux market was valued at US$ 496 million in 2023 and is anticipated to reach US$ 776.2 million by 2030, witnessing a CAGR of...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently...
颁补迟补濒辞驳:听
MRRPB5
April 2023
Price: USD 2,900.00
The global Flip Chip Soldering Flux market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031 with a...
颁补迟补濒辞驳:听
GIR
July 2025
Price: USD 3,480.00
The global market for Flip Chip Soldering Flux was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
颁补迟补濒辞驳:听
MRRPB5
March 2025
Price: USD 2,900.00
Flip-chip flux, also known as flip-chip underfill or flip-chip adhesive, is a specialized adhesive or flux used in semiconductor and microelectronics...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
听
