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Your search for "Flip Chip Ball Grid Array" gave back 5244 results.
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
November 2024
Price: USD 3,950.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
June 2024
Price: USD 2,900.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
June 2024
Price: USD 2,900.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
March 2023
Price: USD 2,900.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
March 2023
Price: USD 2,900.00
Ball-attach flux, often referred to as solder ball-attach flux or BGA (Ball Grid Array) attach flux, is a specialized flux used in electronic...
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MRRPB5
October 2024
Price: USD 3,950.00
Ball-attach flux, often referred to as solder ball-attach flux or BGA (Ball Grid Array) attach flux, is a specialized flux used in electronic...
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MRRPB5
August 2024
Price: USD 2,900.00
An Arrayed Waveguide Grating (AWG) chip is a device based on photonic integrated technology that uses waveguide structures to separate or multiplex...
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MRRPB5
September 2024
Price: USD 2,900.00
FC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for FC Underfills was valued at US$ 181 million in the year 2024 and is projected to reach a revised size of US$ 327 million by...
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MRRPB5
March 2025
Price: USD 2,900.00
FC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Capillary Underfill Material market size was valued at USD 501.1 million in 2023 and is forecast to a readjusted size of USD 838.8 million...
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GIR
May 2024
Price: USD 3,480.00
An underfill is a composite material made up of an epoxy polymer with significant amounts of filler. Underfill is one of the Flip-Chip processes for...
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MRRPB5
December 2024
Price: USD 3,950.00
The global Underfills for Semiconductor market size was valued at US$ 624 million in 2024 and is forecast to a readjusted size of USD 1103 million by...
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GIR
January 2025
Price: USD 3,480.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
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MRRPB5
February 2024
Price: USD 2,900.00
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