0 items USD 0.00Search
- Did you mean
- flir chip wall grid array
Your search for "Flip Chip Ball Grid Array" gave back 5529 results.
The global market for Semiconductor-grade Capillary Underfills was valued at US$ million in the year 2024 and is projected to reach a revised size of...
颁补迟补濒辞驳:听
MRRPB5
April 2025
Price: USD 2,900.00
An underfill is a composite material made up of an epoxy polymer with significant amounts of filler. Underfill is one of the Flip-Chip processes for...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 3,950.00
The global Underfills for Semiconductor market size was valued at US$ 624 million in 2024 and is forecast to a readjusted size of USD 1103 million by...
颁补迟补濒辞驳:听
GIR
January 2025
Price: USD 3,480.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
颁补迟补濒辞驳:听
MRRPB5
February 2024
Price: USD 2,900.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
颁补迟补濒辞驳:听
MRRPB5
February 2023
Price: USD 2,900.00
The global market for Micronporous Silicon Nitride TEM Window Grids was valued at US$ million in the year 2024 and is projected to reach a revised...
颁补迟补濒辞驳:听
MRRPB5
April 2025
Price: USD 2,900.00
The global Micronporous Silicon Nitride TEM Window Grids market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 4,900.00
Semiconductor underfill is used for the underfill encapsulant of chips, usually a thermosetting resin composition, with a flat front shape, no wave...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 5,900.00
The global market for COF PI Films was valued at US$ 387 million in the year 2023 and is projected to reach a revised size of US$ 732 million by 2030...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 2,900.00
The global market for Molded Underfill (MUF) Materials was valued at US$ 580 million in the year 2024 and is projected to reach a revised size of US...
颁补迟补濒辞驳:听
MRRPB5
April 2025
Price: USD 2,900.00
Advanced epoxy molding compounds are specialized epoxy resins formulated for high-performance encapsulation and protection of electronic components...
颁补迟补濒辞驳:听
MRRPB5
October 2023
Price: USD 2,900.00
The global Liquid Molded Underfill market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
颁补迟补濒辞驳:听
GIR
August 2024
Price: USD 3,480.00
The global Liquid Molded Underfill market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 2,900.00
听
