0 items USD 0.00Search
- Did you mean
- flir chip wall grid array
Your search for "Flip Chip Ball Grid Array" gave back 60931 results.
The video intercom chip collects and processes images and sounds, encodes them and transmits them to the backend host through the USB or HDMI...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 5,900.00
Field-Programmable Gate Array (FPGA) is a programmable integrated circuit (IC) or semiconductor device. The device could be reprogrammed as per...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
AI Computing Chip includes graphics processing units (GPUs), field-programmable gate arrays (FPGAs), and certain types of application-specific...
颁补迟补濒辞驳:听
LPI
July 2024
Price: USD 3,660.00
The type of conductive adhesive paste, which is based on epoxy resin, is commonly known as "Epoxy Resin Based Conductive Adhesive Paste."...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
The global PCB Batch Cleaning Machine market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
TDC chips are electronic devices used to measure time intervals with high precision. They convert time-based signals into digital data, making them...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
In-memory computing is the design of memories next to or within the processing elements of hardware. In-memory computing leverages register files,...
颁补迟补濒辞驳:听
LPI
June 2024
Price: USD 3,660.00
Ball Bonder is one sort of semiconductor manufacturing machine, ball bonding is a type of wire bonding, and is the most common way to make the...
颁补迟补濒辞驳:听
MRRPB5
April 2023
Price: USD 2,900.00
The global PCB Batch Cleaning Machine market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (...
颁补迟补濒辞驳:听
MRRPB5
June 2023
Price: USD 4,900.00
The global ASIC and FPGA market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from...
颁补迟补濒辞驳:听
LPI
February 2025
Price: USD 3,660.00
LED chip-on-board refers to the direct contact of bare LED chips with a substrate (such as silicon carbide or sapphire) to produce LED arrays. COB...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
The global market for Thermocompression Bonding Systems was valued at US$ 104 million in the year 2024 and is projected to reach a revised size of US...
颁补迟补濒辞驳:听
MRRPB5
February 2025
Price: USD 2,900.00
The global market for Ball Bonder Machine was valued at US$ 1218 million in the year 2024 and is projected to reach a revised size of US$ 1608...
颁补迟补濒辞驳:听
MRRPB5
April 2025
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 3,950.00
听
