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Your search for "Flip Chip Ball Grid Array" gave back 59979 results.
The global Solder Ball Packaging Material market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD 380.4...
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GIR
June 2024
Price: USD 3,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
March 2024
Price: USD 2,900.00
The global market for Liquid Molding Compounds (LMC) was valued at US$ 600 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Lead Free Solder Spheres market size was valued at US$ 213.1 million in 2023. With growing demand in downstream market, the Lead Free...
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LPI
December 2024
Price: USD 3,660.00
The global Solder Spheres market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD 380.4 million by 2030 with...
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GIR
June 2024
Price: USD 3,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Integrated Circuit Packaging Solder Ball market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD...
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GIR
December 2024
Price: USD 3,480.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
July 2024
Price: USD 4,900.00
The global Electronic Underfill Material market was valued at US$ 314 million in 2023 and is anticipated to reach US$ 428.3 million by 2030,...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Electronic Circuit Board Underfill Material market size was valued at US$ million in 2023. With growing demand in downstream market, the...
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LPI
November 2024
Price: USD 3,660.00
The global market for Spherical Silica for MUF was valued at US$ 30 million in the year 2024 and is projected to reach a revised size of US$ 50.7...
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MRRPB5
March 2025
Price: USD 2,900.00
The global Electronic Underfill Material market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
April 2023
Price: USD 2,900.00
Spherical silica for melamine-urea-formaldehyde (MUF) refers to silica-based particles used as an extender and reinforcement in MUF adhesives and...
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MRRPB5
April 2024
Price: USD 2,900.00
The global market for Antenna-in-Package Technology was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
October 2024
Price: USD 3,950.00
The global Antenna-in-Package Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
August 2024
Price: USD 2,900.00
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