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Your search for "Flip Chip Ball Grid Array" gave back 60432 results.
The global market for Thick Layer Photoresists was valued at US$ 146 million in the year 2024 and is projected to reach a revised size of US$ 215...
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MRRPB5
March 2025
Price: USD 2,900.00
The global Semiconductor Package market size was valued at US$ 28040 million in 2023. With growing demand in downstream market, the Semiconductor...
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LPI
December 2024
Price: USD 3,660.00
Biometric sensors are semiconductors with embedded algorithms that are used in security systems or environments that require user authentication...
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MRRPB5
April 2023
Price: USD 2,900.00
The global market for IC Package Heat Spreaders was valued at US$ 1715 million in the year 2024 and is projected to reach a revised size of US$ 2710...
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MRRPB5
June 2025
Price: USD 2,900.00
Epi/chip. Epitaxy refers to the process of evolving a wafer (sapphire or SiC, for instance) by depositing epitaxial layers on the wafer using MOCVD...
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MRRPB5
May 2024
Price: USD 5,900.00
The global market for Molded Underfill (MUF) Materials was valued at US$ 580 million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
April 2025
Price: USD 2,900.00
The solder ball flattening machine is a device used in the semiconductor packaging process to flatten the tiny solder balls on the semiconductor chip...
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MRRPB5
January 2024
Price: USD 2,900.00
Thick film lithography refers to the process used to make thick film of photoresist; thick film refers to 5 to 100 microns. Thick layer photoresists...
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MRRPB5
February 2024
Price: USD 2,900.00
Thick film lithography refers to the process used to make thick film of photoresist; thick film refers to 5 to 100 microns. Thick layer photoresists...
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GIR
September 2024
Price: USD 3,480.00
Thick film lithography refers to the process used to make thick film of photoresist; thick film refers to 5 to 100 microns. The global Thick Film...
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GIR
September 2024
Price: USD 3,480.00
The global Biometric Sensor Chips market size was valued at US$ 733 million in 2024 and is forecast to a readjusted size of USD 1046 million by 2031...
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GIR
May 2025
Price: USD 3,480.00
The global market for Integrated Heat Spreader (IHS) was valued at US$ 667 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
March 2025
Price: USD 2,900.00
LED probing and testing system is an automatic equipment specially designed for testing flip-chip LED. Flip-chip LED technology refers to the...
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LPI
November 2024
Price: USD 3,660.00
The global Narrowband Carrier Power Line Communication Chip market size was valued at USD million in 2023 and is forecast to a readjusted size of USD...
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GIR
December 2024
Price: USD 3,480.00
Through Computer Control, A Device That Picks Up And Places The Required Solder Balls On The Wafer At One Time The global Wafer Ball Machine market...
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MRRPB5
February 2023
Price: USD 2,900.00
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