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Your search for "Flip Chip Ball Grid Array" gave back 60494 results.
A Focal Plane Array (FPA) Infrared Detector is a sophisticated sensor technology used to capture thermal images by detecting infrared radiation. The...
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MRRPB5
August 2024
Price: USD 2,900.00
A Focal Plane Array (FPA) is a sophisticated sensor device used in imaging systems to detect and measure electromagnetic radiation, including visible...
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MRRPB5
August 2024
Price: USD 2,900.00
Dynamic Inter Array Cables are specialized electrical cables used in offshore wind farms to connect individual wind turbines to each other and to the...
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MRRPB5
July 2024
Price: USD 2,900.00
The global market for Silicon-Based Analog Beamforming Chip was valued at US$ million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
June 2025
Price: USD 2,900.00
The global market for GaAs Single Channel Analog Beamforming Chip was valued at US$ million in the year 2024 and is projected to reach a revised size...
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MRRPB5
June 2025
Price: USD 2,900.00
Fused Silica Lens-arrays are a type of micro-lens array made from melted silica, with lenses that are plano-convex in shape and arranged in a square...
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MRRPB5
July 2024
Price: USD 2,900.00
Delivering the highest accuracy and reliability, LED chip Sorting machine are ideal for vertical chip, CSP, GaN, GaAs, Vertical LED, Flip Chip, and...
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MRRPB5
May 2024
Price: USD 2,900.00
MLCC Array refers to a configuration of multiple MLCCs (Multi-Layer Ceramic Capacitors) arranged in a grid or array format. It involves grouping...
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MRRPB5
January 2024
Price: USD 2,900.00
Solar array disconnect switches are used to isolate solar array form the electric grid. The global Solar Array Disconnect Switches market was valued...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Polymer Micro Lens Arrays market size was valued at US$ million in 2023. With growing demand in downstream market, the Polymer Micro Lens...
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LPI
February 2024
Price: USD 3,660.00
The global market for 3D Semiconductor Packaging was valued at US$ 2107 million in the year 2024 and is projected to reach a revised size of US$ 6157...
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MRRPB5
April 2025
Price: USD 2,900.00
The Thermal Copper Pillar Bump, also known as the thermal bump or TCPB, is a thermoelectric device made from thin-film thermoelectric material...
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MRRPB5
February 2023
Price: USD 2,900.00
Fully-automated industrial versions are for large-scale mass production. Die bonders are specialized semi- or fully-automatic high-precision machine...
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MRRPB5
February 2023
Price: USD 2,900.00
The underfill materials are the fused formulations of the organic polymers and the inorganic fillers. It is used widely in the semiconductor...
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MRRPB5
September 2023
Price: USD 2,900.00
The global market for Liquid Epoxy Capillary Underfill was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
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