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Your search for "OSAT" gave back 891 results.
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
June 2024
Price: USD 5,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
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MRRPB5
May 2024
Price: USD 5,900.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
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MRRPB5
March 2024
Price: USD 3,950.00
Chip Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE 鈫�...
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MRRPB5
March 2024
Price: USD 3,950.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
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MRRPB5
March 2024
Price: USD 2,900.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Automated Probe Systems market size is predicted to grow from US$ 1188 million in 2025 to US$ 1595 million in 2031; it is expected to grow...
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LPI
August 2025
Price: USD 3,660.00
The global Automatic Probe Station market size is predicted to grow from US$ 1188 million in 2025 to US$ 1595 million in 2031; it is expected to grow...
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LPI
March 2025
Price: USD 3,660.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
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MRRPB5
January 2024
Price: USD 2,900.00
Chip Handler in Semiconductors are primarily used to for sorting, testing and transferring chips with the simple electrical interface diagram: ATE 鈫�...
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MRRPB5
January 2024
Price: USD 2,900.00
The global Wire Wedge Bonder Equipment market size was valued at US$ 75 million in 2023. With growing demand in downstream market, the Wire Wedge...
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LPI
January 2024
Price: USD 3,660.00
The global Semiconductor Chip Handler market size was valued at US$ 866.7 million in 2023. With growing demand in downstream market, the...
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LPI
January 2024
Price: USD 3,660.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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GIR
September 2024
Price: USD 3,480.00
Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects...
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GIR
September 2024
Price: USD 3,480.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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GIR
September 2024
Price: USD 3,480.00
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