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Your search for "OSAT" gave back 899 results.
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
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MRRPB5
May 2024
Price: USD 5,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
颁补迟补濒辞驳:听
MRRPB5
March 2024
Price: USD 3,950.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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MRRPB5
March 2024
Price: USD 3,950.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Test Handler market size was valued at USD 1836.4 million in 2023 and is forecast to a readjusted size of USD 3818.7 million by 2030 with...
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GIR
January 2024
Price: USD 3,480.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
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MRRPB5
January 2024
Price: USD 2,900.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The global Flip Chip Bonder market size was valued at US$ 283.7 million in 2023. With growing demand in downstream market, the Flip Chip Bonder is...
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LPI
January 2024
Price: USD 3,660.00
The global Advanced Packaging Inspection Systems market size was valued at US$ 364.6 million in 2023. With growing demand in downstream market, the...
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LPI
January 2024
Price: USD 3,660.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
Thermo Compression Attach. Using this technique, there are no adhesives to join the die and the package. Instead, heat and force are applied to the...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
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MRRPB5
October 2023
Price: USD 2,900.00
Outsourced Semiconductor Assembly and Test (manufacturing) provide third-party IC-packaging and test services. The OSATs are merchant vendors. IDMs...
颁补迟补濒辞驳:听
MRRPB5
October 2023
Price: USD 2,900.00
Wafer Level Packaging (WLP) is combining wafer manufacturing and device encapsulation technologies. WLP is a chip-scale-packaging technology where...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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MRRPB5
January 2023
Price: USD 4,000.00
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