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Your search for "Semiconductor Packaging" gave back 256920 results.
The global Diamond Package Substrate market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of...
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MRRPB5
March 2023
Price: USD 2,900.00
The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2022 and is anticipated to reach US$ 268230 million by 2029,...
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MRRPB5
January 2023
Price: USD 2,900.00
The Thin Shrink Small Outline Package (TSSOP), is a rectangular surface mount plastic ic package with gull-wing leads. Highlights The global Thin...
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MRRPB5
May 2023
Price: USD 2,900.00
The global Power Module Packaging market size was valued at US$ 2163.9 million in 2023. With growing demand in downstream market, the Power Module...
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LPI
February 2024
Price: USD 3,660.00
Bump packaging technology (representing the company TXD Technology) and stacked packaging technology (representing the company Huawei) belong to...
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MRRPB5
March 2023
Price: USD 2,900.00
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to...
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MRRPB5
January 2023
Price: USD 2,900.00
Flat no-leads packages such as quad-flat no-leads (QFN) and dual-flat no-leads (DFN) physically and electrically connect integrated circuits to...
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MRRPB5
January 2023
Price: USD 2,900.00
The lead frame is a metal structure inside the chip package, which is used to transmit signals from the chip to the outside. The global market for...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Ball Grid Array (BGA) Packages market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
March 2023
Price: USD 2,900.00
Electroplating solution for wafer packaging is a type of electroplating solution used in semiconductor wafer packaging processes. It is mainly used...
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MRRPB5
June 2024
Price: USD 2,900.00
Wafer-level bumping packaging and testing service refers to an advanced technical service that packages and tests chips directly on wafers during the...
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LPI
September 2024
Price: USD 3,660.00
The global 3D IC and 2.5D IC Packaging market size was valued at US$ 97850 million in 2023. With growing demand in downstream market, the 3D IC and 2...
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LPI
February 2024
Price: USD 3,660.00
Wafer level chip scale packaging (WLCSP) is a wafer level chip packaging method, which is different from the traditional chip packaging method (...
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MRRPB5
May 2023
Price: USD 2,900.00
A power electronic module or power module acts as a physical container for the storage of several power components, usually power semiconductor...
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MRRPB5
March 2023
Price: USD 2,900.00
Electroplating chemicals for advanced packaging are specialized chemicals used in the electroplating process to deposit a thin metal layer on...
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LPI
August 2024
Price: USD 3,660.00
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