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Your search for "Semiconductor Packaging" gave back 256000 results.
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package...
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GIR
September 2024
Price: USD 3,480.00
Electroplating chemicals for advanced packaging are specialized chemicals used in the electroplating process to deposit a thin metal layer on...
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MRRPB5
July 2024
Price: USD 2,900.00
To protect the diode from contamination, they are enveloped with glass, so the glass packaging rectifier diode is also called as glass passivated...
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MRRPB5
April 2023
Price: USD 2,900.00
The plastic sealing machine is also called the plastic machine, the glue machine, and the plastic sealing machine. It is a machine that can press the...
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LPI
May 2024
Price: USD 3,660.00
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
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MRRPB5
January 2024
Price: USD 2,900.00
Insulated gate bipolar transistor (IGBT) is a compound full-controlled voltage-driven semiconductor power device composed of bipolar transistor (BJT...
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MRRPB5
December 2024
Price: USD 3,950.00
Lead Frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor package...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Semiconductor Lead Frame market size was valued at US$ 3492.1 million in 2023. With growing demand in downstream market, the Semiconductor...
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LPI
January 2024
Price: USD 3,660.00
The global Ceramic Packaging Materials market size was valued at US$ 6817 million in 2024 and is forecast to a readjusted size of USD 13000 million...
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GIR
July 2025
Price: USD 3,480.00
The global Discrete Packaged IGBTs market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR...
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LPI
February 2025
Price: USD 3,660.00
The global market for Wafer Level Packaging Inspection Systems was valued at US$ 367 million in the year 2024 and is projected to reach a revised...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Semiconductor Compression Molding Equipment was valued at US$ 1425 million in the year 2024 and is projected to reach a revised...
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MRRPB5
May 2025
Price: USD 2,900.00
The global market for Photoresist for Packaging was valued at US$ 152 million in the year 2024 and is projected to reach a revised size of US$ 220...
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MRRPB5
February 2025
Price: USD 2,900.00
Wire bonding forms an interconnection between a chip to a substrate, substrate to substrate, or substrate to a package. Wire bonding is generally...
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MRRPB5
August 2024
Price: USD 2,900.00
A three-dimensional integrated circuit (3D IC) is a package with multiple layers of silicon wafers stalked together, along with electronic components...
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MRRPB5
March 2023
Price: USD 2,900.00
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