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Global Discrete Packaged IGBTs Market Research Report 2024

Insulated gate bipolar transistor (IGBT) is a compound full-controlled voltage-driven semiconductor power device composed of bipolar transistor (BJT...
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Semiconductors
MRRPB5
Global
June 2024
Price: USD 2,900.00

Global Photoresist for Packaging Market Growth 2024-2030

The global Photoresist for Packaging market size was valued at US$ 136 million in 2023. With growing demand in downstream market, the Photoresist for...
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Manufacturing (Chemicals)
LPI
Global
June 2024
Price: USD 3,660.00

Global Embedded Die Packaging Technology Market 2025 by Company, Regions, Type and Application, Forecast to 2031

The global Embedded Die Packaging Technology market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by...
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Software
GIR
Global
February 2025
Price: USD 3,480.00

Global Advanced Packaging Interconnect Electroplating Solution Market Research Report 2024

Advanced Packaging Interconnect Electroplating Solutions refer to specialized chemical solutions used in the electroplating process to create...
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Specialty Chemicals
MRRPB5
Global
June 2024
Price: USD 2,900.00

Global Chip Scale Package LEDs (CSP LED) Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

The global Chip Scale Package LEDs (CSP LED) market size was valued at US$ 1452 million in 2024 and is forecast to a readjusted size of USD 3966...
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Semiconductors
GIR
Global
January 2025
Price: USD 3,480.00

Global MEMS Packaging Market Insights, Forecast to 2030

MEMS Packaging is a method of protecting microelectromechanical system (MEMS) devices from the environment by means of physical enclosures. Market...
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IT Services
MRRPB5
Global
December 2024
Price: USD 4,900.00

Global Wafer Inspection and Metrology Systems for Advanced Packaging Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

The global Wafer Inspection and Metrology Systems for Advanced Packaging market size was valued at US$ 433 million in 2024 and is forecast to a...
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Semiconductors
GIR
Global
July 2025
Price: USD 3,480.00

Global Advanced Packaging Interconnect Electroplating Solution Market Growth 2024-2030

Advanced Packaging Interconnect Electroplating Solutions refer to specialized chemical solutions used in the electroplating process to create...
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Manufacturing (Chemicals)
LPI
Global
July 2024
Price: USD 3,660.00

Global LGA Packaging Market Research Report 2024

LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package...
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Semiconductors
MRRPB5
Global
June 2024
Price: USD 2,900.00

Global MEMS Packaging Market Growth (Status and Outlook) 2024-2030

The global MEMS Packaging market size was valued at US$ 41460 million in 2023. With growing demand in downstream market, the MEMS Packaging is...
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IT Services
LPI
Global
November 2024
Price: USD 3,660.00

Global Mini LED Packaging Equipment Supply, Demand and Key Producers, 2024-2030

The global Mini LED Packaging Equipment market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the forecast...
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Manufacturers
GIR
Global
March 2024
Price: USD 4,480.00

Global Simple Packaged MEMS Oscillator Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2031

The global Simple Packaged MEMS Oscillator market size was valued at US$ 162 million in 2024 and is forecast to a readjusted size of USD 559 million...
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Semiconductors
GIR
Global
February 2025
Price: USD 3,480.00

Global Land Grid Array (LGA) Packaging Market Growth 2025-2031

The global Land Grid Array (LGA) Packaging market size is predicted to grow from US$ 458 million in 2025 to US$ 709 million in 2031; it is expected...
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Semiconductors
LPI
Global
February 2025
Price: USD 3,660.00

Embedded Die Packaging Technology - Global Market Share and Ranking, Overall Sales and Demand Forecast 2024-2030

The global market for Embedded Die Packaging Technology was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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IT Services
MRRPB5
Global
September 2024
Price: USD 3,950.00

Global Fan-out Wafer Level Package Market Insights, Forecast to 2030

Fan-out wafer-level packaging is an integrated circuit packaging technology, and an enhancement of standard wafer-level packaging (WLP) solutions...
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Semiconductors
MRRPB5
Global
November 2024
Price: USD 4,900.00

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