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Your search for "flat chip will grid array" gave back 1673702 results.
Total Focusing Method, or TFM for short, is an ultrasonic nondestructive testing technology that focuses multiple sets of collected ultrasonic...
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MRRPB5
October 2024
Price: USD 2,900.00
The global Li-Ion Grid Storage market size was valued at US$ million in 2023. With growing demand in downstream market, the Li-Ion Grid Storage is...
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LPI
September 2024
Price: USD 3,660.00
The global Microinverter market size was valued at US$ million in 2023. With growing demand in downstream market, the Microinverter is forecast to a...
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LPI
February 2024
Price: USD 3,660.00
The global 5G Small Base Station FPGA Chip market size was valued at US$ 2498 million in 2024 and is forecast to a readjusted size of USD 14010...
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GIR
April 2025
Price: USD 3,480.00
A LED Display Screen, or light emitting diode display, is a flat panel display that uses an array of light-emitting diodes as the video display. An...
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MRRPB5
January 2024
Price: USD 2,900.00
A LED Display Screen, or light emitting diode display, is a flat panel display that uses an array of light-emitting diodes as the video display. An...
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MRRPB5
March 2024
Price: USD 3,950.00
A LED Display Screen, or light emitting diode display, is a flat panel display that uses an array of light-emitting diodes as the video display. An...
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MRRPB5
January 2023
Price: USD 2,900.00
The global Integrated Circuit Packaging Solder Ball market size was valued at USD 249.3 million in 2023 and is forecast to a readjusted size of USD...
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GIR
December 2024
Price: USD 3,480.00
A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30鈥�50% less than an...
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MRRPB5
July 2024
Price: USD 2,900.00
The microphone array system refers to the arrangement of microphones, consisting of a certain number of acoustic sensors, used to sample and process...
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MRRPB5
August 2024
Price: USD 2,900.00
In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of...
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MRRPB5
July 2024
Price: USD 4,900.00
The global Advanced Packaging Technologies market size was valued at US$ 14560 million in 2023. With growing demand in downstream market, the...
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LPI
December 2024
Price: USD 3,660.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
April 2024
Price: USD 3,950.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
August 2024
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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GIR
September 2024
Price: USD 3,480.00
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