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Your search for "flir chip wall grid array" gave back 25265 results.
The global market for Ball Grid Array (BGA) Packages was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
September 2024
Price: USD 3,950.00
The global Plastic Ball Grid Array (PBGA) market size was valued at US$ million in 2023. With growing demand in downstream market, the Plastic Ball...
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LPI
September 2024
Price: USD 3,660.00
The global Ball Grid Array (BGA) Packages market size was valued at US$ million in 2023. With growing demand in downstream market, the Ball Grid...
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LPI
September 2024
Price: USD 3,660.00
The global Ball Grid Array(BGA) Microcontroller Socket market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is...
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LPI
July 2024
Price: USD 3,660.00
The global Ball Grid Array(BGA) Microcontroller Socket market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030,...
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MRRPB5
May 2024
Price: USD 2,900.00
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package...
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MRRPB5
June 2024
Price: USD 2,900.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
June 2024
Price: USD 2,900.00
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package...
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MRRPB5
October 2023
Price: USD 2,900.00
The global Ball Grid Array (BGA) Packages market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
March 2023
Price: USD 2,900.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
October 2023
Price: USD 2,900.00
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has...
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MRRPB5
February 2024
Price: USD 2,900.00
Plastic ball grid array (PBGA) are BGA packages adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA has...
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MRRPB5
April 2023
Price: USD 2,900.00
The global market for Antenna-in-Package Technology was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
October 2024
Price: USD 3,950.00
The global Antenna-in-Package Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
August 2024
Price: USD 2,900.00
The worldwide consumption of packaged light emitting diodes in signage and professional displays reached $2.011 billion in 2014. In the year 2019,...
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ElectroniCast
April 2015
Price: USD 4,400.00
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