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Your search for "ic substrate" gave back 33654 results.
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
September 2024
Price: USD 2,900.00
Photoresist (PR) is a chemical that changes properties when exposed to certain wavelengths of light to form desired patterns of coating on substrate...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Crystalline Supermirror market size was valued at US$ 318.9 million in 2023. With growing demand in downstream market, the Crystalline...
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LPI
October 2024
Price: USD 3,660.00
Semiconductor packaging materials play an important role in protecting IC chips from the surrounding environment, ensuring electrical connection for...
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MRRPB5
September 2024
Price: USD 2,900.00
The global market for Substrate-free Thermal Conductive Double-sided Adhesive was valued at US$ million in the year 2024 and is projected to reach a...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Aluminum Nitride Ceramic Substrates for Electronic market is projected to grow from US$ million in 2024 to US$ million by 2030, at a...
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MRRPB5
November 2024
Price: USD 4,900.00
EUV mask blanks are a low-thermal expansion glass substrate with various kinds of optical coating films on its surface. The EUV mask blank consists...
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MRRPB5
November 2023
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
August 2024
Price: USD 4,900.00
This report studies the Insulated Substrates for Power Semiconductors, cover the DBC, AMB and DPC Ceramic Substrates. The global market for Insulated...
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MRRPB5
October 2024
Price: USD 3,950.00
The global PCB & PCBA market size is predicted to grow from US$ 78110 million in 2025 to US$ 95590 million in 2031; it is expected to grow at a...
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LPI
July 2025
Price: USD 3,660.00
The global market for Peelable Ultra Thin Copper Foil was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
HTCC Substrate means High Temperature Co-fired Ceramics Substrate, that is a kind of multilayer ceramic substrate obtained by co-firing a ceramic...
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MRRPB5
April 2024
Price: USD 2,900.00
Electroless Copper for Multi-Layered Boards is an autocatalytic redox reaction. First, it is treated with an activator to adsorb a layer of active...
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MRRPB5
November 2024
Price: USD 3,950.00
Sensitive electronic components mounted on a circuit board often require protection from exposure to harsh environments. While there are several ways...
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LPI
November 2024
Price: USD 3,660.00
Ultra-thin copper foil refers to printed circuit board copper foil of a thickness of 9渭m or less. They are applied to ic board, coreless process and...
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MRRPB5
December 2024
Price: USD 4,900.00
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