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Your search for "ic substrate" gave back 33654 results.
Underfill adhesive for IC packaging is a high-fluidity, high-filling capacity adhesive material specially used in the semiconductor chip packaging...
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GIR
September 2024
Price: USD 3,480.00
Sapphire is kind of sapphire materials which is not only with hardest, most durable and scratch-resistant advantages but also offers a broad...
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MRRPB5
January 2024
Price: USD 2,900.00
The global market for Electroless Palladium was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
March 2025
Price: USD 2,900.00
The global market for Electroless Palladium was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030...
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MRRPB5
November 2024
Price: USD 3,950.00
The global market for Phenolic Resin for PCB was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
April 2025
Price: USD 2,900.00
The global Electroless Palladium market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
March 2024
Price: USD 2,900.00
The global EUV Mask Blanks market size is predicted to grow from US$ 285 million in 2025 to US$ 643 million in 2031; it is expected to grow at a CAGR...
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LPI
April 2025
Price: USD 3,660.00
Thin-film substrate technology uses semiconductor and microsystem technology processes to produce circuit boards on ceramic or organic materials. The...
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MRRPB5
December 2024
Price: USD 4,900.00
As an important high-end branch product in printed circuit board products, COF flexible packaging substrates refer to packaged flexible substrates...
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MRRPB5
November 2024
Price: USD 4,900.00
Phenolic resin is a type of thermosetting polymer that is commonly used in the production of Printed Circuit Boards (PCBs). PCBs are widely used in...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Embedded Die Packaging market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
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GIR
December 2024
Price: USD 3,480.00
LED ceramic substrate is an electronic sheet material, use electronic ceramic as substrate, the membrane and the outer circuit elements apt to form a...
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MRRPB5
May 2024
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
May 2024
Price: USD 3,950.00
Photoresist Dry Film is a type of light-sensitive material used in the manufacturing of printed circuit boards (PCBs) and other microfabrication...
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GIR
August 2024
Price: USD 3,480.00
Molded interconnect substrate (MIS) is a mid-range packaging technology built on a leadframe substrate. It supports single- or multi-die...
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MRRPB5
April 2024
Price: USD 2,900.00
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