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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1688493 results.
Electrochemical Deposition is a rapid and cost-effective method of laying down the bulk of the copper wiring in semiconductor device manufacturing...
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MRRPB5
June 2024
Price: USD 2,900.00
The Composites Were Directly Bonded To The Surface Of Alumina (Al2O3), Aluminum Nitride (Aln) Or Silicon Nitride (Si3N4) Ceramic Substrates At High...
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MRRPB5
June 2024
Price: USD 2,900.00
The global Alumina Thick Film Substrates market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
April 2024
Price: USD 2,900.00
The global ABF (Ajinomoto Build-up Film) market size was valued at US$ 472 million in 2023. With growing demand in downstream market, the ABF (...
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LPI
January 2024
Price: USD 3,660.00
ABF, otherwise known as 鈥淎jinomoto Build-up Film鈥� is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Copper Plating Electrolyte and Additives market size was valued at USD 475 million in 2023 and is forecast to a readjusted size of USD 802...
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GIR
January 2024
Price: USD 3,480.00
Semiconductor UV tape, UV-release tape, is a specialized adhesive tape used in semiconductor manufacturing processes, particularly in the fabrication...
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LPI
May 2024
Price: USD 3,660.00
The global Flip-Chip Flux market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the...
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MRRPB5
March 2023
Price: USD 2,900.00
The global Lead Free Solder Ball market size was valued at US$ 162.8 million in 2023. With growing demand in downstream market, the Lead Free Solder...
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LPI
February 2024
Price: USD 3,660.00
The global GaN Power Amplifier Chip market size was valued at US$ million in 2023. With growing demand in downstream market, the GaN Power Amplifier...
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LPI
February 2024
Price: USD 3,660.00
This report studies the bare ceramic substrates (or blank substrates, white substrate). Ceramic substrate is an electronic sheet material, use...
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MRRPB5
May 2023
Price: USD 2,900.00
Underfill is a material suitable for flip-chip circuits. It fills the gap between the IC chip and the organic substrate, and seals and protects the...
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MRRPB5
February 2023
Price: USD 2,900.00
The global Alumina Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during...
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MRRPB5
March 2023
Price: USD 2,900.00
ABF, otherwise known as 鈥淎jinomoto Build-up Film鈥� is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and...
颁补迟补濒辞驳:听
GIR
August 2024
Price: USD 3,480.00
The global Alumina Thick Film Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
May 2023
Price: USD 2,900.00
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