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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1692030 results.
ABF, otherwise known as 鈥淎jinomoto Build-up Film鈥� is a resin substrate that acts as an insulator in all modern ICs. The ABF is a highly durable and...
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GIR
August 2024
Price: USD 3,480.00
The global Chip On Film Underfill (COF) market size was valued at US$ 385 million in 2024 and is forecast to a readjusted size of USD 479 million by...
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GIR
January 2025
Price: USD 3,480.00
The global Alumina Thick Film Substrates market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR...
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MRRPB5
May 2023
Price: USD 2,900.00
Peelable ultra-thin copper foil with carrier is a necessary base material for preparing chip packaging substrates and HDI boards. Its thickness is...
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LPI
July 2024
Price: USD 3,660.00
The Composites Were Directly Bonded To The Surface Of Alumina (Al2O3), Aluminum Nitride (Aln) Or Silicon Nitride (Si3N4) Ceramic Substrates At High...
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MRRPB5
February 2023
Price: USD 2,900.00
The global market for Flip COB LED Chip was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
May 2025
Price: USD 2,900.00
The global Fast Recovery Epitaxial Diode (FRED) Chips market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD...
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GIR
May 2025
Price: USD 3,480.00
Alumina ceramic substrates are widely used for high precision applications in electronic devices, such as hybrid integrated circuits. The global...
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MRRPB5
December 2024
Price: USD 4,900.00
The global market for Fast Recovery Epitaxial Diode (FRED) Chips was valued at US$ million in the year 2024 and is projected to reach a revised size...
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MRRPB5
March 2025
Price: USD 2,900.00
Thin-film substrate technology uses semiconductor and microsystem technology processes to produce circuit boards on ceramic or organic materials. The...
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MRRPB5
December 2024
Price: USD 4,900.00
UV release dicing tape, also known as UV tape or UV curable tape, is a specialized adhesive film used in semiconductor manufacturing processes,...
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LPI
August 2024
Price: USD 3,660.00
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without...
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MRRPB5
March 2024
Price: USD 2,900.00
Advanced adhesive material testing for industry applications in aerospace, building, energy, automotive and more. A wide array of materials are used...
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MRRPB5
January 2024
Price: USD 2,900.00
The global GaN and AIN Materials market size is predicted to grow from US$ 350 million in 2025 to US$ 562 million in 2031; it is expected to grow at...
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LPI
April 2025
Price: USD 3,660.00
Underfills serve the purpose of equalizing stresses between chip and substrate. Chips are attached directly to the interconnection points without...
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GIR
September 2024
Price: USD 3,480.00
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