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Your search for "Flip Chip Ball Grid Array" gave back 60234 results.
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial...
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LPI
April 2024
Price: USD 3,660.00
The global Ball Array Package market size was valued at US$ million in 2023. With growing demand in downstream market, the Ball Array Package is...
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LPI
December 2024
Price: USD 3,660.00
The global Ball Array Package market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Ball Array Package market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of...
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MRRPB5
March 2023
Price: USD 4,900.00
The global Ball Array Package market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the...
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MRRPB5
November 2023
Price: USD 2,900.00
The global Grid Microphone Array market size is predicted to grow from US$ 234 million in 2024 to US$ 283 million in 2030; it is expected to grow at...
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LPI
February 2025
Price: USD 3,660.00
The global market for Grid Microphone Array was valued at US$ 232 million in the year 2023 and is projected to reach a revised size of US$ 288...
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MRRPB5
January 2025
Price: USD 2,900.00
The global Land Grid Array (LGA) Socket market size is predicted to grow from US$ 180 million in 2025 to US$ 270 million in 2031; it is expected to...
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LPI
February 2025
Price: USD 3,660.00
The global market for Land Grid Array (LGA) Socket was valued at US$ 173 million in the year 2024 and is projected to reach a revised size of US$ 272...
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MRRPB5
February 2025
Price: USD 2,900.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
December 2024
Price: USD 3,950.00
Ultra small wire to circuit board connectors are a type of electronic connector specifically designed to connect and secure printed circuit board...
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LPI
August 2024
Price: USD 3,660.00
Advanced Packaging Technology Market is growing at a CAGR of 8.6% from 2017 to 2026. The growth factors include increasing demand for fresh and...
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Stratistics MRC
May 2019
Price: USD 4,150.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
June 2024
Price: USD 2,900.00
An LGA socket is a type of central processing unit (CPU) socket that uses the land grid array style of integrated circuit packaging. Several...
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MRRPB5
October 2023
Price: USD 2,900.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
November 2024
Price: USD 3,950.00
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