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Your search for "Flip Chip Ball Grid Array" gave back 60262 results.
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
June 2024
Price: USD 2,900.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
June 2024
Price: USD 2,900.00
The global Chip Scale Package (CSP) market size was valued at US$ million in 2023. With growing demand in downstream market, the Chip Scale Package (...
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LPI
December 2024
Price: USD 3,660.00
Pb-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
March 2023
Price: USD 2,900.00
Lead-free solder alloy in commercial use may contain tin, copper, silver, bismuth, indium, zinc, antimony, and traces of other metals. Most lead-free...
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MRRPB5
March 2023
Price: USD 2,900.00
Solder balls, also known as solder spheres, are small balls of solder used primarily in semiconductor packaging. They play a critical role in surface...
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MRRPB5
September 2024
Price: USD 2,900.00
The global BGA Packaging Solder Ball market size is expected to reach $ 236.9 million by 2030, rising at a market growth of 5.9% CAGR during the...
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GIR
April 2024
Price: USD 4,480.00
The global Ceramic Capillary market size was valued at US$ million in 2023. With growing demand in downstream market, the Ceramic Capillary is...
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LPI
December 2024
Price: USD 3,660.00
The global market for Fully Inverted Energy-Saving Cold Screen was valued at US$ 318 million in the year 2024 and is projected to reach a revised...
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MRRPB5
March 2025
Price: USD 2,900.00
The ceramic capillary is an axisymmetric ceramic tool with a vertical center hole, which is used for wire bonding packaging of LEDs, diodes, triodes...
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MRRPB5
March 2024
Price: USD 2,900.00
The ceramic capillary is an axisymmetric ceramic tool with a vertical center hole, which is used for wire bonding packaging of LEDs, diodes, triodes...
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MRRPB5
January 2023
Price: USD 2,900.00
Global 5G Technology Market is accounted for $33.67 billion in 2017 and is expected to reach $3482.89 billion by 2026 growing at a CAGR of 67.44%...
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Stratistics MRC
May 2019
Price: USD 4,150.00
This is the ElectroniCast 2015-2020 global forecast of the use of light emitting diode (LED) professional production lighting in television/broadcast...
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ElectroniCast
January 2016
Price: USD 3,690.00
Ball-attach flux, often referred to as solder ball-attach flux or BGA (Ball Grid Array) attach flux, is a specialized flux used in electronic...
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MRRPB5
October 2024
Price: USD 3,950.00
BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial...
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MRRPB5
March 2024
Price: USD 2,900.00
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