0 items USD 0.00Search
- Did you mean
- flir chip wall grid array
Your search for "Flip Chip Ball Grid Array" gave back 60472 results.
A USB transceiver is usually a chip that implements the hardware parts of the USB protocol for a end device. Nowadays dedicated chips for this are...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 4,900.00
Fully-automated industrial versions are for large-scale mass production. Die bonders are specialized semi- or fully-automatic high-precision machine...
颁补迟补濒辞驳:听
MRRPB5
October 2024
Price: USD 3,950.00
Manual Die Bonder Equipment rigid base is compact, fits on a lab desk and can be expanded with many different options, including eutectic scrub, gas...
颁补迟补濒辞驳:听
MRRPB5
October 2024
Price: USD 3,950.00
The Thermal Copper Pillar Bump, also known as the thermal bump or TCPB, is a thermoelectric device made from thin-film thermoelectric material...
颁补迟补濒辞驳:听
MRRPB5
October 2024
Price: USD 3,950.00
LED probing and testing system is an automatic equipment specially designed for testing flip-chip LED. Flip-chip LED technology refers to the...
颁补迟补濒辞驳:听
MRRPB5
August 2024
Price: USD 2,900.00
The global market for 3D Wafer Bump Inspection System was valued at US$ 303 million in the year 2023 and is projected to reach a revised size of US$...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 2,900.00
The global Liquid Molded Underfill market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
颁补迟补濒辞驳:听
GIR
August 2024
Price: USD 3,480.00
The Thermal Copper Pillar Bump, also known as the thermal bump or TCPB, is a thermoelectric device made from thin-film thermoelectric material...
颁补迟补濒辞驳:听
MRRPB5
July 2024
Price: USD 2,900.00
ElectroniCast Consultants, a leading market/technology consultancy, today announced the release of an update and application expansion to their...
颁补迟补濒辞驳:听
ElectroniCast
April 2019
Price: USD 4,240.00
The global market for Fully Automatic BGA Solder Ball Mounter was valued at US$ 312 million in the year 2023 and is projected to reach a revised size...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 2,900.00
The global market for LGA Packaging was valued at US$ 439 million in the year 2024 and is projected to reach a revised size of US$ 714 million by...
颁补迟补濒辞驳:听
MRRPB5
February 2025
Price: USD 2,900.00
The global Liquid Molded Underfill market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
颁补迟补濒辞驳:听
MRRPB5
June 2024
Price: USD 2,900.00
The global Chip Epoxy Flux market size is predicted to grow from US$ 21.3 million in 2025 to US$ 31.1 million in 2031; it is expected to grow at a...
颁补迟补濒辞驳:听
LPI
April 2025
Price: USD 3,660.00
The global Millimeter-wave Radar Advanced Packaging market size was valued at US$ 922 million in 2024 and is forecast to a readjusted size of USD...
颁补迟补濒辞驳:听
GIR
April 2025
Price: USD 3,480.00
The global WLCSP Sorter market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
听
