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Your search for "Flip Chip Ball Grid Array" gave back 60472 results.
The global Ultra-Small Case Size Passive Electronic Component market size was valued at US$ million in 2023. With growing demand in downstream market...
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LPI
February 2024
Price: USD 3,660.00
LGA (Land Grid Array Package) is a BGA packaging technology that further reduces the height without solder balls. LGA has thinner and lighter package...
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MRRPB5
December 2024
Price: USD 3,950.00
Package on a package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages...
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MRRPB5
November 2024
Price: USD 3,950.00
An FPGA (Field Programmable Gate Array) is an integrated circuit designed to be configured by a customer or a designer after manufacturing. Flash-...
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MRRPB5
September 2024
Price: USD 3,950.00
The global LED Mapping Sorter market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of...
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MRRPB5
June 2023
Price: USD 4,900.00
The global Ultra-Small Case Size Passive Electronic Component market size was valued at USD million in 2023 and is forecast to a readjusted size of...
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GIR
June 2024
Price: USD 3,480.00
TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits...
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MRRPB5
November 2024
Price: USD 3,950.00
Manual Die Bonder Equipment rigid base is compact, fits on a lab desk and can be expanded with many different options, including eutectic scrub, gas...
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MRRPB5
February 2023
Price: USD 2,900.00
The 2013 study has 640 pages, 266 tables and figures. Worldwide markets are poised to achieve significant growth as the Wireless Sensor Network is...
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WinterGreen Research
November 2013
Price: USD 3,800.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
October 2023
Price: USD 2,900.00
Low-alpha beam high purity silica refers to high-purity silica wafers used in semiconductor manufacturing for low alpha particle emission. The global...
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MRRPB5
October 2023
Price: USD 2,900.00
BGA rework machines are specialized systems designed for the precise removal, replacement, and re-soldering of Ball Grid Array (BGA) components on...
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MRRPB5
September 2024
Price: USD 2,900.00
The global market for SoC Deep Learning Chip was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by...
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MRRPB5
October 2024
Price: USD 3,950.00
The global WLCSP Sorter market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the...
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MRRPB5
January 2023
Price: USD 2,900.00
The global Package-on-Package Bonders market size was valued at US$ million in 2023. With growing demand in downstream market, the Package-on-Package...
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LPI
June 2024
Price: USD 3,660.00
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