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Your search for "Flip Chip Ball Grid Array" gave back 60580 results.
The global Mold Release Film for Semiconductor Packaging market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD...
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GIR
September 2024
Price: USD 3,480.00
The global Molded Underfill (MUF) Epoxy Molding Compound (EMC) market was valued at US$ million in 2023 and is anticipated to reach US$ million by...
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MRRPB5
August 2024
Price: USD 2,900.00
Advanced packaging and testing services refer to services that provide advanced packaging and testing technologies and solutions. These services...
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MRRPB5
July 2024
Price: USD 2,900.00
Flip chip bonding is increasingly taking over conventional wire bonding for bonding of microchips, as semiconductor packaging technology advances...
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MRRPB5
June 2024
Price: USD 2,900.00
Industrial LCD monitors are LCD monitors used in industry and come in a variety of display sizes, installation methods, etc. It is also different...
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LPI
June 2024
Price: USD 3,660.00
A vertical LED chip鈥檚 only emitting surface is on the top of the chip, thus it has a narrower light emitting angle with more light on axis and higher...
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MRRPB5
July 2024
Price: USD 2,900.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
May 2024
Price: USD 3,950.00
Low-alpha beam high purity silica refers to high-purity silica wafers used in semiconductor manufacturing for low alpha particle emission. The global...
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MRRPB5
April 2024
Price: USD 2,900.00
Liquid epoxy encapsulant material refers to a low-viscosity epoxy resin used for encapsulating and protecting electronic components and devices. The...
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MRRPB5
April 2024
Price: USD 2,900.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
April 2024
Price: USD 3,950.00
SSR Converters have fast dynamic response, high output voltage accuracy, and small output microwave voltage. They are widely used in fast charging...
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MRRPB5
September 2024
Price: USD 3,950.00
The global Semiconductor Aging Test Socket market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the...
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GIR
March 2024
Price: USD 4,480.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
February 2024
Price: USD 2,900.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
February 2024
Price: USD 2,900.00
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder...
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MRRPB5
March 2024
Price: USD 2,900.00
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