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Your search for "Flip Chip Ball Grid Array" gave back 60831 results.
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
April 2024
Price: USD 3,950.00
SSR Converters have fast dynamic response, high output voltage accuracy, and small output microwave voltage. They are widely used in fast charging...
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MRRPB5
September 2024
Price: USD 3,950.00
The global Semiconductor Aging Test Socket market size is expected to reach $ million by 2030, rising at a market growth of % CAGR during the...
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GIR
March 2024
Price: USD 4,480.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
February 2024
Price: USD 2,900.00
The ball-attach process for BGA and PGA packages uses a flux that is usually applied via pin-transfer from a dipping tray. Solder spheres (solder...
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MRRPB5
March 2024
Price: USD 2,900.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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MRRPB5
February 2024
Price: USD 2,900.00
The global Advanced Semiconductor Packaging market size was valued at US$ 15330 million in 2023. With growing demand in downstream market, the...
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LPI
January 2024
Price: USD 3,660.00
Advanced packaging is a general grouping of a variety of distinct techniques, including 2.5D, 3D-IC, fan-out wafer-level packaging and system-in-...
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GIR
September 2024
Price: USD 3,480.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
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GIR
September 2024
Price: USD 3,480.00
The global market for OFDM Carrier Chips was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031,...
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MRRPB5
January 2025
Price: USD 2,900.00
The global market for Dielectric Chip Antennas was valued at US$ 50.7 million in the year 2024 and is projected to reach a revised size of US$ 76.3...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for FRD Chip was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR...
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MRRPB5
November 2024
Price: USD 3,950.00
The global FRD Chip market size was valued at US$ million in 2023. With growing demand in downstream market, the FRD Chip is forecast to a readjusted...
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LPI
December 2024
Price: USD 3,660.00
HPLC is High Speed Power Line Communication is a broadband power line carrier technology for data transmission over low voltage power lines...
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MRRPB5
November 2024
Price: USD 3,950.00
The global HPLC Chip market size was valued at US$ million in 2023. With growing demand in downstream market, the HPLC Chip is forecast to a...
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LPI
December 2024
Price: USD 3,660.00
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