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Your search for "Flip Chip Ball Grid Array" gave back 59050 results.
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
October 2024
Price: USD 3,950.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
May 2024
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
May 2023
Price: USD 2,900.00
Global Underfill Material Market is accounted for $240.56 million in 2017 and is expected to reach $535.56 million by 2026 growing at a CAGR of 9.3%...
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Stratistics MRC
June 2019
Price: USD 4,150.00
Asia Pacific advanced packaging market will grow by 10.7% annually with a total addressable market cap of $338.4 billion over 2022-2031 owing to the...
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Grace Market Data
January 2022
Price: USD 2,900.00
Europe advanced packaging market was valued at $3,029.1 million in 2021 and will grow by 8.9% annually over 2021-2031 owing to the rising demand for...
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Grace Market Data
January 2022
Price: USD 2,900.00
North America advanced packaging market is projected to grow by 8.1% annually in the forecast period and reach $8,293.6 million by 2031, driven by...
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Grace Market Data
January 2022
Price: USD 2,900.00
Global advanced packaging market will reach $69.17 billion by 2031, growing by 10.0% annually over 2021-2031, driven by the rising demand for...
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Grace Market Data
January 2022
Price: USD 3,500.00
The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back...
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MRRPB5
June 2024
Price: USD 2,900.00
The PCB used for placing the BGA components is known as BGA PCB. It contains similar connections, just like the ball grid array present on the back...
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MRRPB5
January 2023
Price: USD 2,900.00
The global Underfill Materials market size was valued at USD 1204.5 million in 2023 and is forecast to a readjusted size of USD 1587.1 million by...
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GIR
July 2024
Price: USD 3,480.00
Flip chip welding machine is a kind of equipment specially used to realize flip chip welding process. Flip chip welding is to weld the chip face down...
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LPI
July 2024
Price: USD 3,660.00
The global Electronic Underfill Material market size was valued at USD 323.1 million in 2023 and is forecast to a readjusted size of USD 436.8...
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GIR
November 2024
Price: USD 3,480.00
Flip chip welding machine is a kind of equipment specially used to realize flip chip welding process. Flip chip welding is to weld the chip face down...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Spherical Silica for MUF market size was valued at US$ 24 million in 2023. With growing demand in downstream market, the Spherical Silica...
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LPI
October 2024
Price: USD 3,660.00
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