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Your search for "ic substrate" gave back 33617 results.
The global High-temperature Co-fired Ceramic Packages and Substrates market was valued at US$ million in 2023 and is anticipated to reach US$ million...
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MRRPB5
March 2024
Price: USD 2,900.00
Embedded die packaging involves embedding components inside the substrate through a multi-step manufacturing process. The global Embedded Die...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Glass Substrate in Semiconductor market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by 2031...
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GIR
May 2025
Price: USD 3,480.00
The global market for Glass Core Substrates for Semiconductor Packaging was valued at US$ 213 million in the year 2024 and is projected to reach a...
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MRRPB5
March 2025
Price: USD 2,900.00
The global market for AlN Electronic Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Glass Substrate in Semiconductor was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Wafer Hybrid Bonding Machine market size is predicted to grow from US$ 197 million in 2025 to US$ 773 million in 2031; it is expected to...
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LPI
February 2025
Price: USD 3,660.00
The global market for 3D Through Glass Via Substrates was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
February 2025
Price: USD 2,900.00
The global COF Flexible Encapsulation Substrate market size was valued at US$ million in 2023. With growing demand in downstream market, the COF...
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LPI
December 2024
Price: USD 3,660.00
The global market for Substrates for Semiconductor Test Probe Card was valued at US$ 26.1 million in the year 2023 and is projected to reach a...
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MRRPB5
December 2024
Price: USD 2,900.00
As an important high-end branch product in printed circuit board products, COF flexible packaging substrates refer to packaged flexible substrates...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Electroless Plating Solutions for Package Substrate market size was valued at US$ 188 million in 2023 and is forecast to a readjusted size...
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GIR
August 2024
Price: USD 3,480.00
The global Compound Semiconductor Substrate market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
October 2024
Price: USD 3,480.00
The global Ceramic IC Packages market size was valued at US$ million in 2023. With growing demand in downstream market, the Ceramic IC Packages is...
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LPI
October 2024
Price: USD 3,660.00
The global Alumina Multilayered Ceramic Substrates and Packages market size was valued at US$ 332.3 million in 2023. With growing demand in...
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LPI
October 2024
Price: USD 3,660.00
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