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Your search for "ic substrate" gave back 33617 results.
As an important high-end branch product in printed circuit board products, COF flexible packaging substrates refer to packaged flexible substrates...
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MRRPB5
March 2024
Price: USD 2,900.00
The global market for Temporary Wafer Bonding System was valued at US$ 173 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
January 2025
Price: USD 2,900.00
The global Thin Film Ceramic Substrates for Electronic Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by...
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MRRPB5
April 2024
Price: USD 2,900.00
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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GIR
April 2024
Price: USD 3,480.00
The global LED Produts Sapphire Substrate market size was valued at US$ 1001.4 million in 2023. With growing demand in downstream market, the LED...
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LPI
February 2024
Price: USD 3,660.00
Underfill adhesive for IC packaging is a high-fluidity, high-filling capacity adhesive material specially used in the semiconductor chip packaging...
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LPI
July 2024
Price: USD 3,660.00
Rigid substrates, as the name implies, have permanent shape and form. They're made of stacks of thin layers called laminate substrates. Laminate...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for Ultra Thin Lithium Copper Foil was valued at US$ million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Epoxy Resin for PCB was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031...
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MRRPB5
April 2025
Price: USD 2,900.00
The global market for Wafer Hybrid Bonding Machine was valued at US$ 164 million in the year 2024 and is projected to reach a revised size of US$ 756...
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MRRPB5
February 2025
Price: USD 2,900.00
IC testing packages require increased size and greater precision in silicon wafer pad positioning to reduce the number of tests. These test tool...
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LPI
July 2024
Price: USD 3,660.00
The global Ceramic Packaging Substrate Material market size was valued at US$ million in 2024 and is forecast to a readjusted size of USD million by...
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GIR
July 2025
Price: USD 3,480.00
Electroformed stencil aperture walls are smooth (mirror-like), providing less surface area for solder paste to cling to. Instead of laser cutting...
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MRRPB5
October 2023
Price: USD 2,900.00
The global market for Temporary Wafer Bonding System was valued at US$ 161 million in the year 2023 and is projected to reach a revised size of US$...
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MRRPB5
December 2024
Price: USD 2,900.00
The global Electronic Packaging market size was valued at US$ 1171.7 million in 2023. With growing demand in downstream market, the Electronic...
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LPI
February 2024
Price: USD 3,660.00
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