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Your search for "ic substrate" gave back 33654 results.
The global Embedded Die Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Embedded Die Packaging...
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LPI
December 2024
Price: USD 3,660.00
The global Glass Substrate in Semiconductor market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
November 2024
Price: USD 3,480.00
The global High-temperature Co-fired Ceramic Packages and Substrates market size was valued at USD million in 2023 and is forecast to a readjusted...
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GIR
October 2024
Price: USD 3,480.00
Alumina thin film ceramic substrates are widely used in electronic packaging due to their excellent thermal, electrical, and mechanical properties...
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MRRPB5
September 2024
Price: USD 2,900.00
Sapphire is kind of sapphire materials which is not only with hardest, most durable and scratch-resistant advantages but also offers a broad...
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MRRPB5
September 2024
Price: USD 3,950.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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GIR
September 2024
Price: USD 3,480.00
Ultra-thin copper foil refers to printed circuit board copper foil of a thickness of 9渭m or less. They are applied to ic board, coreless process and...
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MRRPB5
May 2024
Price: USD 2,900.00
The global BGA Package Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
April 2024
Price: USD 2,900.00
Photoresist Dry Film is a type of light-sensitive material used in the manufacturing of printed circuit boards (PCBs) and other microfabrication...
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LPI
July 2024
Price: USD 3,660.00
PCB Photosensitive Dry Film is a thin, photosensitive material used in the manufacturing of printed circuit boards (PCBs). It is applied to the...
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LPI
July 2024
Price: USD 3,660.00
The global Electric Materials Ceramic Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing...
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MRRPB5
April 2024
Price: USD 2,900.00
The global CSP Package Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Temporary Wafer Bonding System market size was valued at US$ 178 million in 2024 and is forecast to a readjusted size of USD 262 million...
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GIR
March 2025
Price: USD 3,480.00
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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MRRPB5
April 2024
Price: USD 2,900.00
The global Substrates for Power Electronics market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
April 2024
Price: USD 2,900.00
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