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Your search for "Chip Scale Package" gave back 139224 results.
QFN chip packaging tape is a protective tape with excellent adhesion performance and high temperature resistance, used for fixing and protecting...
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MRRPB5
October 2024
Price: USD 2,900.00
The global market for Embedded Chip Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Multi-chip Package GaN Power ICs market was valued at US$ 678 million in 2023 and is anticipated to reach US$ 1288 million by 2030,...
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MRRPB5
November 2024
Price: USD 2,900.00
The global market for Multi-chip Package GaN Fast Charging ICs was valued at US$ 427 million in the year 2023 and is projected to reach a revised...
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MRRPB5
December 2024
Price: USD 2,900.00
Multi-chip package (MCP) memory refers to a memory device that contains multiple memory chips in a package. The types included in the MCP memory can...
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MRRPB5
November 2024
Price: USD 3,950.00
RDIMM stands for Registered Dual In-Line Memory Module. It is a type of memory module that is commonly used in servers and high-performance computing...
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MRRPB5
November 2024
Price: USD 3,950.00
The chip packaging COF substrate is the key to the current screen transformation. The main principle is to put the display driver IC chip into the...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Multi Chip Module Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Multi Chip Module...
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LPI
October 2024
Price: USD 3,660.00
The global market for Multiple Chip Package (MCP) was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million...
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MRRPB5
October 2024
Price: USD 3,950.00
IC chip packages refer to materials that contain semiconductor devices. Encapsulation is an enclosure that surrounds circuit material to protect it...
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MRRPB5
November 2024
Price: USD 3,950.00
The global Chip Packaging & Testing market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030...
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GIR
December 2024
Price: USD 3,480.00
The global 3D Multi-chip Integrated Packaging market is projected to grow from US$ million in 2024 to US$ million by 2030, at a Compound Annual...
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MRRPB5
November 2024
Price: USD 4,900.00
Non-memory chip packaging substrate refers to the substrate material used to package non-memory type chips (such as processors, analog chips, RF...
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LPI
November 2024
Price: USD 3,660.00
The global Advanced Packaging for AI Chip market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at...
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LPI
November 2024
Price: USD 3,660.00
Market Analysis and Insights: Global Chip Packaging & Testing Market The global Chip Packaging & Testing market is projected to grow from US...
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MRRPB5
November 2024
Price: USD 4,900.00
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