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Your search for "Chip Scale Package" gave back 138761 results.
The global Multi Chip Package (MCP) market size was valued at US$ million in 2023. With growing demand in downstream market, the Multi Chip Package (...
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LPI
March 2024
Price: USD 3,660.00
ALSIC can be used in FCBGA package, high-density chip heat dissipation. The global AlSiC for Flip Chip (FC) Package market was valued at US$ 16...
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MRRPB5
July 2024
Price: USD 2,900.00
Multi-chip package (MCP) memory refers to a memory device that contains multiple memory chips in a package. The types included in the MCP memory can...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Flip-Chip Package Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of...
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MRRPB5
April 2024
Price: USD 2,900.00
Liquid encapsulants are much more flexible than traditional Epoxy mold compounds, removing the need for expensive molding machines and molding plates...
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MRRPB5
May 2024
Price: USD 2,900.00
The global Chip Packaging market size was valued at US$ 30470 million in 2023. With growing demand in downstream market, the Chip Packaging is...
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LPI
January 2024
Price: USD 3,660.00
Automotive electronics encompasses a variety of products 鈥� from body electronics and access systems to engine, lighting and infotainment components...
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MRRPB5
August 2024
Price: USD 2,900.00
Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical...
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GIR
September 2024
Price: USD 3,480.00
The Multi Chip Package is a generically an electronic assembly that multiple integrated circuits, semiconductor dies or other discrete components are...
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MRRPB5
January 2024
Price: USD 2,900.00
Electromagnetically driven mirrors that incorporate our unique micro-electro-mechanical systems (MEMS) technology. They offer a wide optical...
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MRRPB5
March 2024
Price: USD 2,900.00
Kale or leaf cabbage is highly nutrient-dense and is processed to make healthier food and beverages such as chips, juices, powder, and capsules. It...
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MRRPB5
March 2024
Price: USD 2,900.00
Embedding components into substrates using a multi-step manufacturing process.Single-chip, multi-chip, MEMS or passive components can be embedded in...
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MRRPB5
July 2024
Price: USD 2,900.00
RDIMM stands for Registered Dual In-Line Memory Module. It is a type of memory module that is commonly used in servers and high-performance computing...
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MRRPB5
June 2024
Price: USD 2,900.00
The global 5G Chip Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during...
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MRRPB5
June 2024
Price: USD 2,900.00
The global Power Supply in Package and Power Supply on Chip market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030...
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MRRPB5
July 2024
Price: USD 2,900.00
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