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Your search for "Chip Scale Package" gave back 139005 results.
The laser chip heat dissipation packaging base is a key component for thermal management and structural support of laser chips. It is usually made of...
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LPI
October 2024
Price: USD 3,660.00
The global Flip Chip Package Solutions market size was valued at US$ million in 2023. With growing demand in downstream market, the Flip Chip Package...
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LPI
October 2024
Price: USD 3,660.00
TSVs are high-performance interconnect techniques used as an alternative to wire-bond and flip chips to create 3D packages and 3D integrated circuits...
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MRRPB5
November 2024
Price: USD 3,950.00
Probes range from 0.30mm-2.00mm test pitches which apply on Memory Test, Logic Test, High-Frequency Test, LCD Test. The global Chip Package Test...
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MRRPB5
August 2024
Price: USD 2,900.00
A test socket is a custom-designed electro-mechanical interface that delivers extremely clean electrical signal paths to connect the chip to the ATE...
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MRRPB5
August 2024
Price: USD 2,900.00
Chip package lead frame is the basic component that delivers electric signal to external circuits and supports the chip inside of semiconductor...
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MRRPB5
August 2024
Price: USD 2,900.00
Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip...
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LPI
November 2024
Price: USD 3,660.00
Flip chip packaging technology, also known as controlled-collapse chip connection (C4), is an advanced method used in semiconductor packaging to...
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MRRPB5
October 2024
Price: USD 3,950.00
The global market for All-Glass Wafer Level Chip Packaging Materials was estimated to be worth US$ million in 2023 and is forecast to a readjusted...
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MRRPB5
October 2024
Price: USD 3,950.00
Solid-state memory chip packaging substrate is an important material used in the solid-state memory packaging process. As a bridge between the chip...
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MRRPB5
August 2024
Price: USD 2,900.00
The laser chip heat dissipation packaging base is a key component for thermal management and structural support of laser chips. It is usually made of...
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MRRPB5
September 2024
Price: USD 2,900.00
The global market for Multi Chip Module Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Multi Chip Module Packaging Solution was valued at US$ million in the year 2024 and is projected to reach a revised size of US...
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MRRPB5
February 2025
Price: USD 2,900.00
The global Semiconductor Chip Packaging market size was valued at US$ million in 2023. With growing demand in downstream market, the Semiconductor...
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LPI
September 2024
Price: USD 3,660.00
The global market for Flip Chip Package Solutions was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million...
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MRRPB5
January 2025
Price: USD 2,900.00
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