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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1684914 results.
MIS(Molded Interconnect Substrate) is different than traditional substrates, as the technology consists of a pre-molded structure with one or more...
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MRRPB5
January 2023
Price: USD 2,900.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
August 2024
Price: USD 2,900.00
The global Alumina Thick Film Substrates market size was valued at US$ million in 2023. With growing demand in downstream market, the Alumina Thick...
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LPI
October 2024
Price: USD 3,660.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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GIR
September 2024
Price: USD 3,480.00
The global Bare Ceramic Substrate market size was valued at US$ 321.9 million in 2023. With growing demand in downstream market, the Bare Ceramic...
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LPI
October 2024
Price: USD 3,660.00
The global Advanced Packaging market size was valued at US$ 259690 million in 2024 and is forecast to a readjusted size of USD 488970 million by 2031...
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GIR
May 2025
Price: USD 3,480.00
The global market for Alumina Substrates was valued at US$ 315 million in the year 2023 and is projected to reach a revised size of US$ 469 million...
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MRRPB5
December 2024
Price: USD 2,900.00
One feature of aluminum electrolytic capacitors is that they can be produced relatively inexpensively and in high volume. They also have a wide range...
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MRRPB5
October 2024
Price: USD 3,950.00
The global ABF Substrate (FC-BGA) market size was valued at US$ 3135.3 million in 2023. With growing demand in downstream market, the ABF Substrate (...
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LPI
October 2024
Price: USD 3,660.00
Flip chip welding machine is a kind of equipment specially used to realize flip chip welding process. Flip chip welding is to weld the chip face down...
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LPI
July 2024
Price: USD 3,660.00
The global market for Wafer Packaging Materials was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Aluminum Oxide Ceramic Substrates was valued at US$ 315 million in the year 2023 and is projected to reach a revised size of US...
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MRRPB5
December 2024
Price: USD 2,900.00
One feature of aluminum electrolytic capacitors is that they can be produced relatively inexpensively and in high volume. They also have a wide range...
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MRRPB5
July 2024
Price: USD 2,900.00
The global market for Molded Interconnect Substrate (MIS) was valued at US$ 98 million in the year 2024 and is projected to reach a revised size of...
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MRRPB5
February 2025
Price: USD 2,900.00
Wafer packaging is to cut the wafer of the previous wafer process into small wafers (Die) after the dicing process, and then mount the cut wafer on...
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MRRPB5
April 2024
Price: USD 2,900.00
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