0 items USD 0.00Search
- Did you mean
- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1685330 results.
The global market for FC BGA was valued at US$ 5355 million in the year 2024 and is projected to reach a revised size of US$ 10003 million by 2031,...
颁补迟补濒辞驳:听
MRRPB5
June 2025
Price: USD 2,900.00
As an important high-end branch product in printed circuit board products, COF flexible packaging substrates refer to packaged flexible substrates...
颁补迟补濒辞驳:听
MRRPB5
November 2024
Price: USD 4,900.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
颁补迟补濒辞驳:听
MRRPB5
January 2024
Price: USD 2,900.00
The global Chip Encapsulation Material market was valued at US$ 23780 million in 2023 and is anticipated to reach US$ 34470 million by 2030,...
颁补迟补濒辞驳:听
MRRPB5
February 2024
Price: USD 2,900.00
A glass substrate for semiconductor packaging refers to a specially designed glass material used as a base or platform for constructing and...
颁补迟补濒辞驳:听
LPI
February 2024
Price: USD 3,660.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 2,900.00
The global Ultra-low Particulate Air Fan Filter Unit (ULPA FFU) market size was valued at US$ 90 million in 2023. With growing demand in downstream...
颁补迟补濒辞驳:听
LPI
December 2024
Price: USD 3,660.00
Highlights The global Chip Encapsulation Material market was valued at US$ 25810 million in 2022 and is anticipated to reach US$ 34470 million by...
颁补迟补濒辞驳:听
MRRPB5
February 2023
Price: USD 2,900.00
The global EUV Mask Inspection System market size is projected to grow from US$ million in 2023 to US$ million in 2030; it is expected to grow at a...
颁补迟补濒辞驳:听
LPI
May 2024
Price: USD 3,660.00
The global LED Glass Substrate market size is predicted to grow from US$ 1101 million in 2025 to US$ 1265 million in 2031; it is expected to grow at...
颁补迟补濒辞驳:听
LPI
July 2025
Price: USD 3,660.00
The global market for MIS Packaging Material was valued at US$ 98 million in the year 2024 and is projected to reach a revised size of US$ 228...
颁补迟补濒辞驳:听
MRRPB5
June 2025
Price: USD 2,900.00
The global Chip Encapsulation Material market size was valued at US$ 26560 million in 2024 and is forecast to a readjusted size of USD 36800 million...
颁补迟补濒辞驳:听
GIR
January 2025
Price: USD 3,480.00
The FC-BGA (Flip Chip Ball Grid Array) semiconductor substrate is a critical component in advanced electronic packaging, particularly in high-...
颁补迟补濒辞驳:听
LPI
November 2024
Price: USD 3,660.00
Semiconductor laser ceramic substrate is a high-performance ceramic material used to support and dissipate heat from semiconductor laser chips. It...
颁补迟补濒辞驳:听
LPI
November 2024
Price: USD 3,660.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
颁补迟补濒辞驳:听
MRRPB5
March 2024
Price: USD 3,950.00
听
