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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1687037 results.
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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MRRPB5
April 2024
Price: USD 2,900.00
As an important high-end branch product in printed circuit board products, COF flexible packaging substrates refer to packaged flexible substrates...
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MRRPB5
March 2024
Price: USD 2,900.00
The global Dicing Die Bonding Films market size was valued at US$ million in 2023. With growing demand in downstream market, the Dicing Die Bonding...
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LPI
March 2024
Price: USD 3,660.00
The global market for ABF (Ajinomoto Build-up Film) Substrate estimated at US$ 5.35 billion in the year 2024, is projected to reach a revised size of...
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MRRPB5
April 2025
Price: USD 3,350.00
COF grade flexible copper foil substrate, namely Chip On Film's flexible copper foil substrate, is a die soft film assembly technology that...
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GIR
April 2024
Price: USD 3,480.00
An RFID (Radio Frequency Identification) apparel inlay refers to a small electronic component embedded within clothing or apparel items that contains...
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LPI
June 2024
Price: USD 3,660.00
ABF (Ajinomoto Build-up Film) substrate (or FC BGA ), a type of semiconductor substrate, connects high-integrated semiconductor chips and substrates...
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MRRPB5
November 2024
Price: USD 2,900.00
The global Photo Mask Inspection Equipment market size was valued at US$ million in 2023. With growing demand in downstream market, the Photo Mask...
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LPI
June 2024
Price: USD 3,660.00
The global Alumina Substrates market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a CAGR...
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GIR
October 2024
Price: USD 3,480.00
The global Chip Encapsulation Material market size is predicted to grow from US$ 27540 million in 2025 to US$ 37180 million in 2031; it is expected...
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LPI
April 2025
Price: USD 3,660.00
The global Mask Inspection System market size was valued at US$ 1038.9 million in 2023. With growing demand in downstream market, the Mask Inspection...
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LPI
January 2024
Price: USD 3,660.00
The global 3D Semiconductor Packaging market size is predicted to grow from US$ 2061 million in 2025 to US$ 5403 million in 2031; it is expected to...
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LPI
January 2025
Price: USD 3,660.00
The global market for Chip Encapsulation Material was valued at US$ 26960 million in the year 2024 and is projected to reach a revised size of US$...
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MRRPB5
March 2025
Price: USD 2,900.00
Lidar ceramic substrate refers to the ceramic substrate used in LiDAR systems. It has the characteristics of good chemical stability, high thermal...
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LPI
November 2024
Price: USD 3,660.00
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC)...
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MRRPB5
August 2023
Price: USD 2,900.00
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