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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1686205 results.
Silver sintered pressed IGBT devices refer to power semiconductor devices that use silver sintering technology to press-fit and package the IGBT chip...
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LPI
July 2024
Price: USD 3,660.00
The global IC Packaging Glass Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Glass Packaging Substrate market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Embedded Chip Packaging Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
August 2024
Price: USD 2,900.00
The global FC-BGA Package Substrates market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %...
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MRRPB5
June 2024
Price: USD 2,900.00
Automotive Grade MCU Chips require far more than industrial-grade and consumer-grade MCU chips in terms of functional safety, data security, and...
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MRRPB5
January 2023
Price: USD 2,900.00
Wire bonding is the basic technology in which an electrical connection between the chip contact surfaces (pads) and the chip carrier or substrate is...
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MRRPB5
May 2024
Price: USD 2,900.00
The global FC-BGA Package Substrates market size was valued at US$ million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
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GIR
August 2024
Price: USD 3,480.00
Silver sintering die bonding machine is a precision equipment that uses silver sintering technology to achieve efficient and reliable connection...
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LPI
November 2024
Price: USD 3,660.00
The global Embedded Chip Packaging market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR...
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LPI
February 2025
Price: USD 3,660.00
Aluminum nitride substrate refers to a ceramic material with aluminum nitride (AIN) as the main crystalline phase, and then etched with metal...
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MRRPB5
January 2024
Price: USD 2,900.00
Extreme Ultraviolet (EUV) Photomask Substrates are complex multilayer film stacks. The global Extreme Ultraviolet (EUV) Photomask Substrates market...
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MRRPB5
March 2024
Price: USD 2,900.00
The "Thick Film" refers to the thickness of conductor layer on Ceramic PCB. Normally the thickness will be at least exceeds 10 miron (um),...
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MRRPB5
February 2024
Price: USD 2,900.00
The global market for Silicon Based LED Chips was valued at US$ 3 million in the year 2024 and is projected to reach a revised size of US$ 5 million...
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MRRPB5
February 2025
Price: USD 2,900.00
The global market for Embedded Chip Packaging was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by...
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MRRPB5
February 2025
Price: USD 2,900.00
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