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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1686205 results.
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
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GIR
September 2024
Price: USD 3,480.00
The global market for Build-up Film for ABF Substrate was estimated to be worth US$ 596 million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
November 2024
Price: USD 3,950.00
After the automatic alignment by vision inspection, the solder balls as well as Coper core balls are gang-mounted on the BGA (ball grid array) strip-...
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LPI
July 2024
Price: USD 3,660.00
The global market for Quartz Glass Substrate Photomask was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
September 2024
Price: USD 3,950.00
The global market for Soda Glass Substrate Photomask was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
September 2024
Price: USD 3,950.00
Refers to the CCL mainly used for package carrier board. The global Copper Clad Laminate (CCL) for Carrier Board market is projected to reach US$...
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MRRPB5
October 2023
Price: USD 2,900.00
IC substrate is a type of carry material for integrated circuit with internal circuit to connect the chips and PCBs. Additionally, the IC substrate...
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LPI
May 2024
Price: USD 3,660.00
IC substrate loading and unloading machine is a kind of equipment specially used for automatically handling chip substrates in semiconductor...
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MRRPB5
September 2024
Price: USD 2,900.00
The global Soda Glass Substrate Photomask market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Quartz Glass Substrate Photomask market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a...
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MRRPB5
July 2024
Price: USD 2,900.00
The global Lateral LED Chip market size is predicted to grow from US$ 1591 million in 2025 to US$ 1929 million in 2031; it is expected to grow at a...
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LPI
July 2025
Price: USD 3,660.00
LED lighting substrate is a basic material used to support and connect LED chips. It not only provides physical support, but also has an important...
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MRRPB5
September 2024
Price: USD 2,900.00
Automotive OSATs (Outsourced Semiconductor Assembly and Test) are specialized service providers that offer a wide range of semiconductor packaging...
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MRRPB5
February 2023
Price: USD 4,900.00
The global High Accuracy Flip Chip Bonder Machine market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to...
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LPI
July 2025
Price: USD 3,660.00
Thick film circuit printing is a process technology that prints a larger thickness on the substrate. Generally, the printing thickness is more than...
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MRRPB5
January 2024
Price: USD 2,900.00
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