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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1685893 results.
There are surface mount packaging with electrode pads on all four sides of the ceramic substrate without pins, and the chip is packaged on a ceramic...
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LPI
August 2024
Price: USD 3,660.00
Chip Die Bonders are automated equipment used to fix chips to substrates through eutectic alloys (such as tin-lead alloys, indium-tin alloys, etc.)...
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MRRPB5
September 2024
Price: USD 2,900.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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MRRPB5
July 2024
Price: USD 4,900.00
Traditional LEDs usually undergo from the chip/die manufacturing to packaging processes where the die would be attached to an interposer such as a...
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LPI
May 2024
Price: USD 3,660.00
The global Flip Chip CSP market size was valued at US$ million in 2023. With growing demand in downstream market, the Flip Chip CSP is forecast to a...
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LPI
March 2024
Price: USD 3,660.00
The global Microfluidic Glass market size was valued at US$ 176.5 million in 2023. With growing demand in downstream market, the Microfluidic Glass...
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LPI
February 2024
Price: USD 3,660.00
The global Chip Epoxy Flux market size was valued at US$ 18 million in 2023. With growing demand in downstream market, the Chip Epoxy Flux is...
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LPI
January 2024
Price: USD 3,660.00
The global Glass Microfluidic Chip market size was valued at US$ 248.1 million in 2023. With growing demand in downstream market, the Glass...
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LPI
January 2024
Price: USD 3,660.00
PCBs are key component of various electronic products. They are used in computers, communications, and various consumer electronic products and...
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MRRPB5
July 2024
Price: USD 4,350.00
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components...
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MRRPB5
August 2024
Price: USD 2,900.00
The global 3D Semiconductor Packaging market size was valued at US$ 2168 million in 2024 and is forecast to a readjusted size of USD 6208 million by...
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GIR
July 2025
Price: USD 3,480.00
Flip Chip Ball Grid Array is a mid-cost, high-performance, semiconductor packaging solution that utilizes the controlled collapse chip connection...
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MRRPB5
May 2023
Price: USD 2,900.00
The global IC Substrate market size is predicted to grow from US$ 15570 million in 2025 to US$ 26470 million in 2031; it is expected to grow at a...
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LPI
May 2025
Price: USD 3,660.00
The global Extreme Ultraviolet (EUV) Photomask Substrates market size is expected to reach $ million by 2030, rising at a market growth of % CAGR...
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GIR
April 2024
Price: USD 4,480.00
The global market for Molded Interconnect Substrate Technology was valued at US$ 98 million in the year 2024 and is projected to reach a revised size...
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MRRPB5
June 2025
Price: USD 2,900.00
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