0 items USD 0.00Search
- Did you mean
- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1685789 results.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
颁补迟补濒辞驳:听
MRRPB5
March 2024
Price: USD 3,950.00
The global IC Substrate Material market size was valued at US$ million in 2023. With growing demand in downstream market, the IC Substrate Material...
颁补迟补濒辞驳:听
LPI
October 2024
Price: USD 3,660.00
An IGBT (Insulated Gate Bipolar Transistor) Module Heat Dissipation Substrate is a critical component in power electronics used to manage and...
颁补迟补濒辞驳:听
LPI
July 2024
Price: USD 3,660.00
The global Chip Encapsulation Material market size was valued at US$ 26560 million in 2023 and is forecast to a readjusted size of USD 36800 million...
颁补迟补濒辞驳:听
GIR
September 2024
Price: USD 3,480.00
The global market for Glass Core Substrates for Semiconductor Packaging was valued at US$ 213 million in the year 2024 and is projected to reach a...
颁补迟补濒辞驳:听
MRRPB5
March 2025
Price: USD 2,900.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
颁补迟补濒辞驳:听
MRRPB5
January 2023
Price: USD 4,000.00
The global market for GaN-on-Si LED Chips was valued at US$ 3 million in the year 2024 and is projected to reach a revised size of US$ 5 million by...
颁补迟补濒辞驳:听
MRRPB5
February 2025
Price: USD 2,900.00
The global Silicon Carbide Power Chip market size is predicted to grow from US$ 5883 million in 2025 to US$ 18560 million in 2031; it is expected to...
颁补迟补濒辞驳:听
LPI
August 2025
Price: USD 3,660.00
Coir substrate, also known as coconut coir or coconut fiber substrate, is a natural, renewable growing medium used in horticulture, agriculture, and...
颁补迟补濒辞驳:听
MRRPB5
May 2024
Price: USD 2,900.00
Electrochemical Deposition is a rapid and cost-effective method of laying down the bulk of the copper wiring in semiconductor device manufacturing...
颁补迟补濒辞驳:听
LPI
July 2024
Price: USD 3,660.00
IC package substrate materials play a crucial role in providing a reliable and efficient electrical connection between the integrated circuit (IC)...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 2,900.00
3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect at the package level such as wire bonding and flip...
颁补迟补濒辞驳:听
MRRPB5
April 2024
Price: USD 3,950.00
The global market for Flip Chip Bonder was valued at US$ 297 million in the year 2024 and is projected to reach a revised size of US$ 322 million by...
颁补迟补濒辞驳:听
MRRPB5
January 2025
Price: USD 2,900.00
The global 3D Semiconductor Packaging market size was valued at US$ 1514.1 million in 2023. With growing demand in downstream market, the 3D...
颁补迟补濒辞驳:听
LPI
January 2024
Price: USD 3,660.00
The global market for Advanced IC Substrates was valued at US$ 12720 million in the year 2023 and is projected to reach a revised size of US$ 21000...
颁补迟补濒辞驳:听
MRRPB5
December 2024
Price: USD 2,900.00
听
