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- fan-out chip on substrate (focus)
Your search for "Fan-Out Chip on Substrate (FOCoS)" gave back 1685893 results.
The global Flip Chip Bonder market size was valued at US$ 306 million in 2024 and is forecast to a readjusted size of USD 331 million by 2031 with a...
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GIR
June 2025
Price: USD 3,480.00
Market Analysis and Insights: Global Chip Encapsulation Material Market The global Chip Encapsulation Material market is projected to grow from US$...
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MRRPB5
August 2024
Price: USD 4,900.00
The global market for Chip Encapsulation Material was estimated to be worth US$ 23780 million in 2023 and is forecast to a readjusted size of US$...
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MRRPB5
June 2024
Price: USD 5,900.00
The global Glass Microfluidic Chip market size is predicted to grow from US$ 215 million in 2025 to US$ 411 million in 2031; it is expected to grow...
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LPI
April 2025
Price: USD 3,660.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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GIR
September 2024
Price: USD 3,480.00
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made...
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MRRPB5
January 2023
Price: USD 2,900.00
The global Semi-Automatic Flip Chip Bonders market size is predicted to grow from US$ 67.4 million in 2025 to US$ 72.6 million in 2031; it is...
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LPI
February 2025
Price: USD 3,660.00
The global market for Laser Debonding Equipment was valued at US$ 168 million in the year 2023 and is projected to reach a revised size of US$ 288...
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MRRPB5
November 2024
Price: USD 2,900.00
LCoS (Liquid Crystal on Silicon) chips are a type of display technology that utilizes liquid crystal panels mounted on a silicon backing. These chips...
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LPI
November 2024
Price: USD 3,660.00
The global High-end IC Substrate market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR...
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LPI
February 2025
Price: USD 3,660.00
FCBGA (Flip-Chip Ball Grid Array), a type of semiconductor substrate, connects high-integrated semiconductor chips and substrates using flip-chip...
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MRRPB5
November 2024
Price: USD 2,900.00
The paste for chip resistors is a key material for manufacturing chip resistors. This paste is applied on the ceramic substrate by screen printing...
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LPI
November 2024
Price: USD 3,660.00
The FC-BGA (Flip Chip Ball Grid Array) multi-layer substrate is a critical component in advanced electronic packaging, particularly in high-...
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LPI
November 2024
Price: USD 3,660.00
The global Dicing Die Bonding Films market size was valued at USD million in 2023 and is forecast to a readjusted size of USD million by 2030 with a...
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GIR
August 2024
Price: USD 3,480.00
The global Memory Chip Chiller market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of...
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LPI
March 2025
Price: USD 3,660.00
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